Russell Westerman

Person

Land O'Lakes, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Protective coating for plasma dicing
- Patent number 11,908,741
- Issue date Feb 20, 2024
- Plasma-Therm LLC
- Russell Westerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion filter using aperture plate with plurality of zones
- Patent number 11,747,494
- Issue date Sep 5, 2023
- Plasma-Therm LLC
- Leslie Michael Lea
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 11,651,999
- Issue date May 16, 2023
- Plasma-Therm LLC
- Tsu-Wu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective coating for plasma dicing
- Patent number 11,587,834
- Issue date Feb 21, 2023
- Plasma-Therm LLC
- Russell Westerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 11,488,865
- Issue date Nov 1, 2022
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dicing die attach film
- Patent number 10,943,825
- Issue date Mar 9, 2021
- Plasma-Therm LLC
- Marco Notarianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,818,552
- Issue date Oct 27, 2020
- Plasma-Therm LLC
- Tsu-Wu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,741,447
- Issue date Aug 11, 2020
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,707,060
- Issue date Jul 7, 2020
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,573,557
- Issue date Feb 25, 2020
- Plasma-Therm LLC
- David Pays-Volard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dicing a substrate with back metal
- Patent number 10,497,621
- Issue date Dec 3, 2019
- Plasma-Therm LLC
- Peter Falvo
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,297,427
- Issue date May 21, 2019
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 10,269,641
- Issue date Apr 23, 2019
- Plasma-Therm LLC
- Tsu-Wu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,911,654
- Issue date Mar 6, 2018
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,711,406
- Issue date Jul 18, 2017
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number RE46339
- Issue date Mar 14, 2017
- Plasma-Therm LLC
- Rich Gauldin
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,564,366
- Issue date Feb 7, 2017
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,496,177
- Issue date Nov 15, 2016
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dicing a substrate with back metal
- Patent number 9,368,404
- Issue date Jun 14, 2016
- Plasma-Therm LLC
- Peter Falvo
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,343,365
- Issue date May 17, 2016
- Plasma-Therm LLC
- Thierry Lazerand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,202,721
- Issue date Dec 1, 2015
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,202,737
- Issue date Dec 1, 2015
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,202,720
- Issue date Dec 1, 2015
- Plasma-Therm LLC
- Linnell Martinez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,105,705
- Issue date Aug 11, 2015
- Plasma-Therm LLC
- David Pays-Volard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,082,839
- Issue date Jul 14, 2015
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,070,760
- Issue date Jun 30, 2015
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,980,764
- Issue date Mar 17, 2015
- Plasma-Therm LLC
- Linnell Martinez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,946,058
- Issue date Feb 3, 2015
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,802,545
- Issue date Aug 12, 2014
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,796,154
- Issue date Aug 5, 2014
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROSTATIC DISCHARGE PREVENTION IN ION BEAM SYSTEM
- Publication number 20230343727
- Publication date Oct 26, 2023
- Plasma-Therm NES LLC
- Sarpangala Hariharakeshava Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIRTUAL SHUTTER IN ION BEAM SYSTEM
- Publication number 20230343557
- Publication date Oct 26, 2023
- Plasma-Therm NES LLC
- Sarpangala Hariharakeshava Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20230343647
- Publication date Oct 26, 2023
- Plasma-Therm LLC
- Russell Westerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20230253252
- Publication date Aug 10, 2023
- Plasma-Therm LLC
- Tsu-Wu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20230020438
- Publication date Jan 19, 2023
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Source Configuration
- Publication number 20210391150
- Publication date Dec 16, 2021
- Plasma-Therm LLC
- Leslie Michael Lea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20210020513
- Publication date Jan 21, 2021
- Plasma-Therm LLC
- Tsu-Wu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION FILTER USING APERTURE PLATE WITH PLURALITY OF ZONES
- Publication number 20200319356
- Publication date Oct 8, 2020
- Plasma-Therm LLC
- Leslie Michael Lea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Dicing Die Attach Film
- Publication number 20200083084
- Publication date Mar 12, 2020
- Plasma-Therm LLC
- Marco Notarianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Dicing Die Attach Film
- Publication number 20190371667
- Publication date Dec 5, 2019
- Plasma-Therm LLC
- Russell Westerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20190244859
- Publication date Aug 8, 2019
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20190189513
- Publication date Jun 20, 2019
- Plasma-Therm LLC
- Tsu-Wu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20190013243
- Publication date Jan 10, 2019
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Dicing a Substrate with Back Metal
- Publication number 20180254215
- Publication date Sep 6, 2018
- PLASMA-THERM, LLC
- Peter Falvo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20180190542
- Publication date Jul 5, 2018
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20180151435
- Publication date May 31, 2018
- Plasma-Therm LLC
- Tsu-Wu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ion Filter
- Publication number 20180143332
- Publication date May 24, 2018
- Plasma-Therm LLC
- Leslie Michael Lea
- G01 - MEASURING TESTING
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20170033008
- Publication date Feb 2, 2017
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20170025311
- Publication date Jan 26, 2017
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Dicing a Substrate with Back Metal
- Publication number 20160254189
- Publication date Sep 1, 2016
- PLASMA-THERM, LLC
- Peter Falvo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20160111332
- Publication date Apr 21, 2016
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20150371878
- Publication date Dec 24, 2015
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20150270121
- Publication date Sep 24, 2015
- Plasma-Therm LLC
- David Pays-Volard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20150270154
- Publication date Sep 24, 2015
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20150255297
- Publication date Sep 10, 2015
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20150255347
- Publication date Sep 10, 2015
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer
- Publication number 20140242780
- Publication date Aug 28, 2014
- Plasma-Therm LLC
- Rich Gauldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20140235034
- Publication date Aug 21, 2014
- Plasma-Therm LLC
- David Pays-Volard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20140154869
- Publication date Jun 5, 2014
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Dicing a Substrate with Back Metal
- Publication number 20140094018
- Publication date Apr 3, 2014
- PLASMA-THERM, LLC
- Peter Falvo
- B28 - WORKING CEMENT, CLAY, OR STONE

Russell Westerman

Person

Patents Grantslast 30 patents

Protective coating for plasma dicing

Ion filter using aperture plate with plurality of zones

Method and apparatus for plasma dicing a semi-conductor wafer

Protective coating for plasma dicing

Method and apparatus for plasma dicing a semi-conductor wafer

Method for dicing die attach film

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method for dicing a substrate with back metal

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method for dicing a substrate with back metal

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Patents Applicationslast 30 patents

ELECTROSTATIC DISCHARGE PREVENTION IN ION BEAM SYSTEM

VIRTUAL SHUTTER IN ION BEAM SYSTEM

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

Plasma Source Configuration

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

ION FILTER USING APERTURE PLATE WITH PLURALITY OF ZONES

Method for Dicing Die Attach Film

Method for Dicing Die Attach Film

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

Method for Dicing a Substrate with Back Metal

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

Ion Filter

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method for Dicing a Substrate with Back Metal

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-Conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method for Dicing a Substrate with Back Metal