Ruzaini Ibrahim

Follow

Person

Bandar Puncak Alam, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with combined power and ground ring structure
- Patent number 9,305,898
- Issue date Apr 5, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kong Bee Tiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader for integrated circuit device
- Patent number 9,064,838
- Issue date Jun 23, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Ruzaini B. Ibrahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat semiconductor device with additional contacts
- Patent number 8,981,541
- Issue date Mar 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Kong Bee Tiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling semiconductor device with heat spreader
- Patent number 8,012,799
- Issue date Sep 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ruzaini Ibrahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging semiconductor die without lead frame or substrate
- Patent number 7,432,130
- Issue date Oct 7, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Aminuddin Ismail
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH COMBINED POWER AND GROUND RING STRUCTURE
- Publication number 20150206834
- Publication date Jul 23, 2015
- KONG BEE TIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE
- Publication number 20150076680
- Publication date Mar 19, 2015
- Ruzaini B. Ibrahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT SEMICONDUCTOR DEVICE WITH ADDITIONAL CONTACTS
- Publication number 20150014833
- Publication date Jan 15, 2015
- Kong Bee Tiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR SEMICONDUCTOR PACKAGE
- Publication number 20110012257
- Publication date Jan 20, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Poh Leng EU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink for semiconductor package
- Publication number 20070200225
- Publication date Aug 30, 2007
- Ruzaini Ibrahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging semiconductor die
- Publication number 20070178626
- Publication date Aug 2, 2007
- Aminuddin Ismail
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die semiconductor device
- Publication number 20030111720
- Publication date Jun 19, 2003
- Lan Chu Tan
- H01 - BASIC ELECTRIC ELEMENTS