Ryan C. Johnson

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Woburn, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer semiconductor devices fabricated using a combination of...
- Patent number 9,881,904
- Issue date Jan 30, 2018
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for assembly of multi-layer semiconductor d...
- Patent number 9,812,429
- Issue date Nov 7, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interconnect Structures for Assembly of Multi-Layer Semiconductor D...
- Publication number 20170092621
- Publication date Mar 30, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Semiconductor Devices Fabricated Using a Combination of...
- Publication number 20170040296
- Publication date Feb 9, 2017
- Massachusetts Institute of Technology
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS