Ryan HOOPER

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Tempe, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame having redistribution layer
- Patent number 10,381,295
- Issue date Aug 13, 2019
- NXP USA, INC.
- Michael Vincent
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME HAVING REDISTRIBUTION LAYER
- Publication number 20190080991
- Publication date Mar 14, 2019
- NXP USA, Inc.
- Michael VINCENT
- H01 - BASIC ELECTRIC ELEMENTS