Ryan Park

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,764,133
- Issue date Sep 19, 2023
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,362,025
- Issue date Jun 14, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separators for handling, transporting, or storing semiconductor wafers
- Patent number 11,257,700
- Issue date Feb 22, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20190067173
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20190067072
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
RIGID CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20190067061
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
- Publication number 20190067064
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
- Publication number 20190067062
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS