Ryan S. Riegle

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Endicott, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Enhanced reliability semiconductor package
- Patent number 7,719,108
- Issue date May 18, 2010
- Lockheed Martin Corporation
- William E. Murphy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliability enhancement process
- Patent number 7,670,877
- Issue date Mar 2, 2010
- Lockheed Martin Corporation
- William E. Murphy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RELIABILITY ENHANCEMENT PROCESS
- Publication number 20080032455
- Publication date Feb 7, 2008
- Lockheed Martin Corporation
- William E. Murphy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reliability enhancement process
- Publication number 20060151581
- Publication date Jul 13, 2006
- William E. Murphy
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR