Ryan Scott SMITH

Person

Clifton Park, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Formation of metal vias on metal lines
- Patent number 12,113,020
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Ryan Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanofluidic device with silicon nitride membrane
- Patent number 11,819,847
- Issue date Nov 21, 2023
- Applied Materials, Inc.
- Ryan Scott Smith
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Via and skip via structures
- Patent number 10,485,111
- Issue date Nov 19, 2019
- GLOBALFOUNDRIES Inc.
- Shao Beng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via and skip via structures
- Patent number 10,199,261
- Issue date Feb 5, 2019
- GLOBALFOUNDRIES Inc.
- James McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch profile control during skip via formation
- Patent number 10,109,526
- Issue date Oct 23, 2018
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level electrical test for optical proximity correction and/or...
- Patent number 10,078,107
- Issue date Sep 18, 2018
- GLOBALFOUNDRIES Inc.
- Jaime Bravo
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SILICON SUPER JUNCTION STRUCTURES FOR INCREASED VOLTAGE
- Publication number 20240282809
- Publication date Aug 22, 2024
- Applied Materials, Inc.
- Amirhasan NOURBAKHSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF METAL VIAS ON METAL LINES
- Publication number 20220270979
- Publication date Aug 25, 2022
- Applied Materials, Inc.
- Ryan Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHODS FOR DUAL PORE SENSORS
- Publication number 20220242725
- Publication date Aug 4, 2022
- Applied Materials, Inc.
- Joseph R. JOHNSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DUAL PORE SENSORS
- Publication number 20220236250
- Publication date Jul 28, 2022
- Applied Materials, Inc.
- Joseph R. JOHNSON
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
NANOFLUIDIC DEVICE WITH SILICON NITRIDE MEMBRANE
- Publication number 20220016628
- Publication date Jan 20, 2022
- Applied Materials, Inc.
- Ryan Scott SMITH
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20190027401
- Publication date Jan 24, 2019
- GLOBALFOUNDRIES INC.
- James McMahon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA AND SKIP VIA STRUCTURES
- Publication number 20190021176
- Publication date Jan 17, 2019
- GLOBALFOUNDRIES INC.
- Shao Beng Law
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL ELECTRICAL TEST FOR OPTICAL PROXIMITY CORRECTION AND/OR...
- Publication number 20170115337
- Publication date Apr 27, 2017
- GLOBALFOUNDRIES INC.
- Jaime BRAVO
- G01 - MEASURING TESTING
Information Patent Application
METHOD, APPARATUS, AND SYSTEM FOR PASSIVE DIE STRAIN MEASUREMENT
- Publication number 20170052014
- Publication date Feb 23, 2017
- GLOBALFOUNDRIES INC.
- RYAN SCOTT SMITH
- G01 - MEASURING TESTING

Ryan Scott SMITH

Person

Patents Grantslast 30 patents

Formation of metal vias on metal lines

Nanofluidic device with silicon nitride membrane

Via and skip via structures

Via and skip via structures

Etch profile control during skip via formation

Wafer level electrical test for optical proximity correction and/or...

Patents Applicationslast 30 patents

SILICON SUPER JUNCTION STRUCTURES FOR INCREASED VOLTAGE

FORMATION OF METAL VIAS ON METAL LINES

MANUFACTURING METHODS FOR DUAL PORE SENSORS

DUAL PORE SENSORS

NANOFLUIDIC DEVICE WITH SILICON NITRIDE MEMBRANE

VIA AND SKIP VIA STRUCTURES

VIA AND SKIP VIA STRUCTURES

WAFER LEVEL ELECTRICAL TEST FOR OPTICAL PROXIMITY CORRECTION AND/OR...

METHOD, APPARATUS, AND SYSTEM FOR PASSIVE DIE STRAIN MEASUREMENT