Ryan Simpson

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Maricopa, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
In-process wire bond testing using wire bonding apparatus
- Patent number 12,148,730
- Issue date Nov 19, 2024
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Continuous wire bonds for battery module
- Patent number 12,100,864
- Issue date Sep 24, 2024
- Atieva, Inc.
- DodgieReigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTINUOUS WIRE BONDS FOR BATTERY MODULE
- Publication number 20230261341
- Publication date Aug 17, 2023
- Atieva, Inc.
- DodgieReigh M. Calpito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-PROCESS WIRE BOND TESTING
- Publication number 20230215835
- Publication date Jul 6, 2023
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS