Ryan Tordillo Comadre

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with blind hole attachment to heat sink
- Patent number 12,191,229
- Issue date Jan 7, 2025
- Infineon Technologies AG
- Ryan Tordillo Comadre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer interconnection ribbon
- Patent number 11,705,387
- Issue date Jul 18, 2023
- Infineon Technologies AG
- Emil Lamco Jocson
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package with Blind Hole Attachment to Heat Sink
- Publication number 20230125452
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Ryan Tordillo Comadre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Interconnection Ribbon
- Publication number 20220068770
- Publication date Mar 3, 2022
- Emil Lamco Jocson
- H01 - BASIC ELECTRIC ELEMENTS