Ryo FUJIKAWA

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Shizuoka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Contact-connection structure
- Patent number 10,056,708
- Issue date Aug 21, 2018
- Yazaki Corporation
- Masanori Onuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector
- Patent number 9,742,100
- Issue date Aug 22, 2017
- Yazaki Corporation
- Ryo Fujikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded parts lock mechanism
- Patent number 8,769,782
- Issue date Jul 8, 2014
- Yazaki Corporation
- Ryo Fujikawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mounting structure of connector for circuit board
- Patent number 8,573,988
- Issue date Nov 5, 2013
- Yazaki Corporation
- Ryo Fujikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEALING MEMBER AND CONNECTOR
- Publication number 20170110826
- Publication date Apr 20, 2017
- YAZAKI CORPORATION
- Ryo Fujikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR
- Publication number 20170093080
- Publication date Mar 30, 2017
- YAZAKI CORPORATION
- Ryo FUJIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT-CONNECTION STRUCTURE
- Publication number 20170033487
- Publication date Feb 2, 2017
- YAZAKI CORPORATION
- Masanori ONUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN MOLDED PARTS LOCK MECHANISM
- Publication number 20120180274
- Publication date Jul 19, 2012
- YAZAKI CORPORATION
- Ryo Fujikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE OF CONNECTOR FOR CIRCUIT BOARD
- Publication number 20120184117
- Publication date Jul 19, 2012
- YAZAKI CORPORATION
- Ryo Fujikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR