Ryo Fukasawa

Person

Nagano-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect substrate and method of making the same
- Patent number 11,462,501
- Issue date Oct 4, 2022
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and electronic component device
- Patent number 10,187,979
- Issue date Jan 22, 2019
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate with buried substrate having linear conductors
- Patent number 9,960,120
- Issue date May 1, 2018
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,799,596
- Issue date Oct 24, 2017
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making the same
- Patent number 9,721,876
- Issue date Aug 1, 2017
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and semiconductor package
- Patent number 9,530,725
- Issue date Dec 27, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe card having a wiring substrate
- Patent number 9,488,677
- Issue date Nov 8, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- G01 - MEASURING TESTING
Information Patent Grant
Probe card
- Patent number 9,476,913
- Issue date Oct 25, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- G01 - MEASURING TESTING
Information Patent Grant
Probe card
- Patent number 9,470,718
- Issue date Oct 18, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- G01 - MEASURING TESTING
Information Patent Grant
Probe card and method for manufacturing probe card
- Patent number 9,459,289
- Issue date Oct 4, 2016
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- G01 - MEASURING TESTING
Information Patent Grant
Stacked electronic device
- Patent number 9,373,587
- Issue date Jun 21, 2016
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,204,544
- Issue date Dec 1, 2015
- Shinko Electric Industries Co., Ltd.
- Michio Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, method for manufacturing wiring substrate, and se...
- Patent number 9,202,781
- Issue date Dec 1, 2015
- Shinko Electric Industries Co., Ltd.
- Yuko Karasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 9,040,832
- Issue date May 26, 2015
- Shinko Electric Industries Co., Ltd.
- Yuichiro Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dye sensitized solar cell module and manufacturing method thereof
- Patent number 7,977,569
- Issue date Jul 12, 2011
- Shinko Electric Industries Co., Ltd.
- Sumihiro Ichikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method and apparatus for processing a conductive thin film
- Patent number 7,648,906
- Issue date Jan 19, 2010
- Shinko Electric Industries Co., Ltd.
- Koji Takei
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Fuel cell
- Patent number 7,169,501
- Issue date Jan 30, 2007
- Shinko Electric Industries Co., Ltd.
- Shigeaki Suganuma
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20210125953
- Publication date Apr 29, 2021
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE
- Publication number 20180184518
- Publication date Jun 28, 2018
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20170229388
- Publication date Aug 10, 2017
- Shinko Electric Industries Co., Ltd.
- RYO FUKASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20160293535
- Publication date Oct 6, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20160260661
- Publication date Sep 8, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo Fukasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20160181190
- Publication date Jun 23, 2016
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD
- Publication number 20150137849
- Publication date May 21, 2015
- Shinko Electric Industries Co., LTD.
- Michio Horiuchi
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150022230
- Publication date Jan 22, 2015
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150022229
- Publication date Jan 22, 2015
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140347833
- Publication date Nov 27, 2014
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140262465
- Publication date Sep 18, 2014
- Shinko Electric Industries Co., Ltd.
- Michio HORIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE CARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140125372
- Publication date May 8, 2014
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- G01 - MEASURING TESTING
Information Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SE...
- Publication number 20140117539
- Publication date May 1, 2014
- Shinko Electric Industries Co., Ltd.
- Yuko KARASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120247814
- Publication date Oct 4, 2012
- Shinko Electric Industries Co., Ltd.
- Yuichiro Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FILM FORMING METHOD AND MANUFACTURING METHOD OF MULTI-LAYER...
- Publication number 20090169727
- Publication date Jul 2, 2009
- Shinko Electric Industries Co., Ltd.
- Ryo FUKASAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DYE SENSITIZED SOLAR CELL MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20080236662
- Publication date Oct 2, 2008
- Shinko Electric Industries Co., Ltd.
- Sumihiro Ichikawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method and apparatus for processing a conductive thin film
- Publication number 20060160340
- Publication date Jul 20, 2006
- Koji Takei
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Fuel cell
- Publication number 20040121197
- Publication date Jun 24, 2004
- Shinko Electric Industries Co. Ltd
- Shigeaki Suganuma
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Ryo Fukasawa

Person

Patents Grantslast 30 patents

Interconnect substrate and method of making the same

Wiring substrate and electronic component device

Wiring substrate with buried substrate having linear conductors

Wiring substrate and semiconductor device

Semiconductor device and method of making the same

Wiring substrate and semiconductor package

Probe card having a wiring substrate

Probe card

Probe card

Probe card and method for manufacturing probe card

Stacked electronic device

Wiring substrate and method of manufacturing the same

Wiring substrate, method for manufacturing wiring substrate, and se...

Wiring substrate and method of manufacturing the same

Dye sensitized solar cell module and manufacturing method thereof

Method and apparatus for processing a conductive thin film

Fuel cell

Patents Applicationslast 30 patents

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE

WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD

PROBE CARD AND METHOD OF MANUFACTURING THE SAME

PROBE CARD AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

PROBE CARD AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND SE...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

COPPER FILM FORMING METHOD AND MANUFACTURING METHOD OF MULTI-LAYER...

DYE SENSITIZED SOLAR CELL MODULE AND MANUFACTURING METHOD THEREOF

Method and apparatus for processing a conductive thin film

Fuel cell