Ryo Fukuchi

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,171
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface treated copper foil, surface treated copper foil with resin...
- Patent number 10,925,170
- Issue date Feb 16, 2021
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated copper foil, copper foil with carrier, laminate, me...
- Patent number 10,820,414
- Issue date Oct 27, 2020
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treated copper foil, copper foil with carrier, laminate, me...
- Patent number 10,791,631
- Issue date Sep 29, 2020
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper heat dissipation material, carrier-attached copper foil, con...
- Patent number 10,464,291
- Issue date Nov 5, 2019
- JX Nippon Mining & Metals Corporation
- Hajime Momoi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil, copper-clad laminate board, method for producing print...
- Patent number 10,448,507
- Issue date Oct 15, 2019
- JX Nippon Mining & Metals Corporation
- Ryo Fukuchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Surface-treated copper foil
- Patent number 10,383,222
- Issue date Aug 13, 2019
- JX Nippon Mining & Metals Corporation
- Atsushi Miki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface-treated copper foil
- Patent number 10,070,521
- Issue date Sep 4, 2018
- JX Nippon Mining & Metals Corporation
- Ryo Fukuchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper heat dissipation material, carrier-attached copper foil, con...
- Patent number 9,724,896
- Issue date Aug 8, 2017
- JX Nippon Mining & Metals Corporation
- Hajime Momoi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Liquid crystal polymer copper-clad laminate and copper foil used fo...
- Patent number 9,060,431
- Issue date Jun 16, 2015
- JX Nippon Mining & Metals Corporation
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rolled copper foil or electrolytic copper foil for electronic circu...
- Patent number 8,668,994
- Issue date Mar 11, 2014
- JX Nippon Mining & Metals Corporation
- Keisuke Yamanishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Rolled copper foil or electrolytic copper foil for electronic circu...
- Patent number 8,580,390
- Issue date Nov 12, 2013
- JX Nippon Mining & Metals Corporation
- Keisuke Yamanishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of forming electronic circuit
- Patent number 8,357,307
- Issue date Jan 22, 2013
- JX Nippon Mining & Metals Corporation
- Keisuke Yamanishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...
- Publication number 20180288881
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...
- Publication number 20180288867
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- RYO FUKUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...
- Publication number 20180288884
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- Yuki Ori
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Me...
- Publication number 20180160546
- Publication date Jun 7, 2018
- JX NIPPON MINING & METALS CORPORATION
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Me...
- Publication number 20180160529
- Publication date Jun 7, 2018
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attach...
- Publication number 20170303405
- Publication date Oct 19, 2017
- JX NIPPON MINING & METALS CORPORATION
- RYO FUKUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Con...
- Publication number 20170291397
- Publication date Oct 12, 2017
- JX NIPPON MINING & METALS CORPORATION
- Hajime MOMOI
- B32 - LAYERED PRODUCTS
Information Patent Application
Copper Foil, Copper-Clad Laminate Board, Method For Producing Print...
- Publication number 20170208680
- Publication date Jul 20, 2017
- JX NIPPON MINING & METALS CORPORATION
- Ryo Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Foil, Copper-Clad Laminate Board, Method for Producing Print...
- Publication number 20170208686
- Publication date Jul 20, 2017
- JX NIPPON MINING & METALS CORPORATION
- RYO FUKUCHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface-Treated Copper Foil
- Publication number 20170196083
- Publication date Jul 6, 2017
- JX NIPPON MINING & METALS CORPORATION
- Atsushi Miki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surface-Treated Metal Material, Metal Foil With Carrier, Connector,...
- Publication number 20160212836
- Publication date Jul 21, 2016
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Con...
- Publication number 20160120017
- Publication date Apr 28, 2016
- JX NIPPON MINING & METALS CORPORATION
- HAJIME MOMOI
- B32 - LAYERED PRODUCTS
Information Patent Application
Surface-Treated Copper Foil
- Publication number 20150079415
- Publication date Mar 19, 2015
- JX NIPPON MINING & METALS CORPORATION
- Ryo Fukuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used Fo...
- Publication number 20140093743
- Publication date Apr 3, 2014
- JX NIPPON MINING & METALS CORPORATION
- Hideta Arai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20130270218
- Publication date Oct 17, 2013
- Keisuke Yamanishi
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC CIRCUIT, METHOD FOR FORMING SAME, AND COPPER CLAD LAMINA...
- Publication number 20120318568
- Publication date Dec 20, 2012
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110300401
- Publication date Dec 8, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110297641
- Publication date Dec 8, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110293960
- Publication date Dec 1, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of Forming Electronic Circuit
- Publication number 20110284496
- Publication date Nov 24, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...
- Publication number 20110259848
- Publication date Oct 27, 2011
- JX NIPPON MINING & METALS CORPORATION
- Keisuke Yamanishi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Ryo Fukuchi

Person

Patents Grantslast 30 patents

Surface treated copper foil, surface treated copper foil with resin...

Surface treated copper foil, surface treated copper foil with resin...

Surface treated copper foil, copper foil with carrier, laminate, me...

Surface treated copper foil, copper foil with carrier, laminate, me...

Copper heat dissipation material, carrier-attached copper foil, con...

Copper foil, copper-clad laminate board, method for producing print...

Surface-treated copper foil

Surface-treated copper foil

Copper heat dissipation material, carrier-attached copper foil, con...

Liquid crystal polymer copper-clad laminate and copper foil used fo...

Rolled copper foil or electrolytic copper foil for electronic circu...

Rolled copper foil or electrolytic copper foil for electronic circu...

Method of forming electronic circuit

Patents Applicationslast 30 patents

Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...

SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...

Surface Treated Copper Foil, Surface Treated Copper Foil With Resin...

Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Me...

Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Me...

Copper Foil, Copper Foil for High-Frequency Circuit, Carrier-Attach...

Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Con...

Copper Foil, Copper-Clad Laminate Board, Method For Producing Print...

Copper Foil, Copper-Clad Laminate Board, Method for Producing Print...

Surface-Treated Copper Foil

Surface-Treated Metal Material, Metal Foil With Carrier, Connector,...

Copper Heat Dissipation Material, Carrier-Attached Copper Foil, Con...

Surface-Treated Copper Foil

Liquid Crystal Polymer Copper-Clad Laminate and Copper Foil Used Fo...

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

ELECTRONIC CIRCUIT, METHOD FOR FORMING SAME, AND COPPER CLAD LAMINA...

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...

Method of Forming Electronic Circuit

Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circu...