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Ryo Maniwa
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Laminate printed circuit board with a magnetic layer
Patent number
6,111,479
Issue date
Aug 29, 2000
NEC Corporation
Osamu Myohga
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Method of manufacturing a multilayered printed wiring board
Patent number
5,526,564
Issue date
Jun 18, 1996
NEC Corporation
Tutomu Ohshima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of and apparatus for plating printed circuit board
Patent number
5,480,675
Issue date
Jan 2, 1996
NEC Corporation
Tomoo Murakami
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Multilayered printed wiring board and method of manufacturing the same
Patent number
5,455,393
Issue date
Oct 3, 1995
NEC Corporation
Tutomu Ohshima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing multilayer printed wiring boards
Patent number
5,258,094
Issue date
Nov 2, 1993
NEC Corporation
Seiji Furui
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for manufacturing printed wiring boards
Patent number
5,218,761
Issue date
Jun 15, 1993
NEC Corporation
Ryo Maniwa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR