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Ryo OISHI

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  • Saitama, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,929,343
    • Issue date Mar 12, 2024
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor devices
    • Patent number 11,721,660
    • Issue date Aug 8, 2023
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,737,356
    • Issue date Aug 11, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,610,976
    • Issue date Apr 7, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,525,555
    • Issue date Jan 7, 2020
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,468,370
    • Issue date Nov 5, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,414,002
    • Issue date Sep 17, 2019
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,137,534
    • Issue date Nov 27, 2018
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,121,758
    • Issue date Nov 6, 2018
    • Nippon Micrometal Corporation
    • Daizo Oda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Method for forming ball in bonding wire
    • Patent number 10,121,764
    • Issue date Nov 6, 2018
    • Nippon Micrometal Corporation
    • Noritoshi Araki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,032,741
    • Issue date Jul 24, 2018
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 9,887,172
    • Issue date Feb 6, 2018
    • Nippon Micrometal Corporation
    • Daizo Oda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 9,773,748
    • Issue date Sep 26, 2017
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding wire for semiconductor device use and method of production...
    • Patent number 9,543,266
    • Issue date Jan 10, 2017
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Grant

    Bonding wire for semiconductor device use and method of production...
    • Patent number 9,536,854
    • Issue date Jan 3, 2017
    • Nippon Micrometal Corporation
    • Takashi Yamada
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor
    • Patent number 8,815,019
    • Issue date Aug 26, 2014
    • Nippon Steel & Sumikin Materials., Ltd.
    • Tomohiro Uno
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

  • Information Patent Application

    AI BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240312946
    • Publication date Sep 19, 2024
    • Tetsuya OYAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240297142
    • Publication date Sep 5, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290743
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • G01 - MEASURING TESTING
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290745
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • G01 - MEASURING TESTING
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20240290744
    • Publication date Aug 29, 2024
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AI WIRING MATERIAL
    • Publication number 20240105668
    • Publication date Mar 28, 2024
    • NIPPON MICROMETAL CORPORATION
    • Yuto KURIHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230387066
    • Publication date Nov 30, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230335528
    • Publication date Oct 19, 2023
    • NIPPON MICROMETAL COPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Al WIRING MATERIAL
    • Publication number 20230302584
    • Publication date Sep 28, 2023
    • NIPPON MICROMETAL CORPORATION
    • Tomohiro UNO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Al WIRING MATERIAL
    • Publication number 20230299037
    • Publication date Sep 21, 2023
    • NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
    • Tomohiro UNO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230245995
    • Publication date Aug 3, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20230215834
    • Publication date Jul 6, 2023
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR D...
    • Publication number 20230154884
    • Publication date May 18, 2023
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
    • Publication number 20230013769
    • Publication date Jan 19, 2023
    • NIPPON MICROMETAL CORPORATION
    • Ryo OISHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AL WIRING MATERIAL
    • Publication number 20220341004
    • Publication date Oct 27, 2022
    • NIPPON MICROMETAL CORPORATION
    • Yuto KURIHARA
    • C21 - METALLURGY OF IRON
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20200013748
    • Publication date Jan 9, 2020
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20180133843
    • Publication date May 17, 2018
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20180130763
    • Publication date May 10, 2018
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20180122765
    • Publication date May 3, 2018
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    METHOD FOR FORMING BALL IN BONDING WIRE
    • Publication number 20180096965
    • Publication date Apr 5, 2018
    • NIPPON MICROMETAL CORPORATION
    • Noritoshi ARAKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170323864
    • Publication date Nov 9, 2017
    • Nippon Micrometal Corporation
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170216974
    • Publication date Aug 3, 2017
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170200689
    • Publication date Jul 13, 2017
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170200690
    • Publication date Jul 13, 2017
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170194280
    • Publication date Jul 6, 2017
    • Nippon Micrometal Corporation
    • Daizo ODA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20170179064
    • Publication date Jun 22, 2017
    • Takashi YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
    • Publication number 20160111389
    • Publication date Apr 21, 2016
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION...
    • Publication number 20160104687
    • Publication date Apr 14, 2016
    • NIPPON MICROMETAL CORPORATION
    • Takashi YAMADA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR
    • Publication number 20110120594
    • Publication date May 26, 2011
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...