Ryo TAGA

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Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PROCESSING A WAFER AND WAFER
- Publication number 20240139902
- Publication date May 2, 2024
- Shin-Etsu Handotai Co., Ltd.
- Yasuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR A SUBSTRATE WAFER
- Publication number 20230173633
- Publication date Jun 8, 2023
- Shin-Etsu Handotai Co., Ltd.
- Ryo TAGA
- B24 - GRINDING POLISHING