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Ryohei Masui
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Osaka, JP
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last 30 patents
Information
Patent Grant
Conductive particles, method for producing conductive particles, co...
Patent number
9,446,484
Issue date
Sep 20, 2016
Sekisui Chemical Co., Ltd.
Ryohei Masui
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Adhesive for electronic components
Patent number
8,901,207
Issue date
Dec 2, 2014
Sekisui Chemical Co., Ltd.
Akinobu Hayakawa
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Method of producing semiconductor chip laminate comprising an adhes...
Patent number
8,563,362
Issue date
Oct 22, 2013
Sekisui Chemical Co., Ltd.
Akinobu Hayakawa
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Adhesive for electronic component
Patent number
7,838,577
Issue date
Nov 23, 2010
Sekisui Chemical Co., Ltd.
Akinobu Hayakawa
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Patents Applications
last 30 patents
Information
Patent Application
CONDUCTIVE PARTICLES, METHOD FOR PRODUCING CONDUCTIVE PARTICLES, CO...
Publication number
20150008022
Publication date
Jan 8, 2015
Sekisui Chemical Co., Ltd.
Ryohei Masui
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FO PRODUCING SEMICONDUCTOR CHIP STACK, AND SEMICONDUCTOR DEVICE
Publication number
20120021233
Publication date
Jan 26, 2012
SEKISUI CHEMICAL CO., LTD.
Akinobu Hayakawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE FOR ELECTRONIC COMPONENTS
Publication number
20120016057
Publication date
Jan 19, 2012
Akinobu Hayakawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
ADHESIVE FOR ELECTRONIC COMPONENT
Publication number
20100197830
Publication date
Aug 5, 2010
Sekisui Chemical Co., Ltd.
Akinobu Hayakawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...