Ryohei Yamamoto

Person

  • Tokyo, JP

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PEELING APPARATUS

    • Publication number 20230373129
    • Publication date Nov 23, 2023
    • Disco Corporation
    • Koyo HONOKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONVEYING APPARATUS AND PEELING APPARATUS

    • Publication number 20230082612
    • Publication date Mar 16, 2023
    • Disco Corporation
    • Koyo HONOKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    IMAGE FORMING APPARATUS

    • Publication number 20230046301
    • Publication date Feb 16, 2023
    • Canon Kabushiki Kaisha
    • Ryohei Yamamoto
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    WAFER PRODUCING METHOD

    • Publication number 20230048318
    • Publication date Feb 16, 2023
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    IMAGE FORMING APPARATUS

    • Publication number 20230047171
    • Publication date Feb 16, 2023
    • Canon Kabushiki Kaisha
    • Tetsuro Sakamoto
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    PEELING APPARATUS

    • Publication number 20220410431
    • Publication date Dec 29, 2022
    • Disco Corporation
    • Koyo HONOKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PEELING METHOD AND PEELING APPARATUS

    • Publication number 20220379520
    • Publication date Dec 1, 2022
    • Disco Corporation
    • Ryohei YAMAMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DETECTING APPARATUS

    • Publication number 20220268700
    • Publication date Aug 25, 2022
    • Disco Corporation
    • Kazuki MORI
    • G01 - MEASURING TESTING
  • Information Patent Application

    WAFER MANUFACTURING APPARATUS

    • Publication number 20220181174
    • Publication date Jun 9, 2022
    • Disco Corporation
    • Ryohei Yamamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD AND LASER PROCESSING APPARATUS

    • Publication number 20220161367
    • Publication date May 26, 2022
    • DISCO CORPORATION
    • Ryohei Yamamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER FORMING APPARATUS

    • Publication number 20210327733
    • Publication date Oct 21, 2021
    • Disco Corporation
    • Kentaro IIZUKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SiC WAFER MANUFACTURING METHOD AND SiC WAFER MANUFACTURING APPARATUS

    • Publication number 20200391327
    • Publication date Dec 17, 2020
    • Disco Corporation
    • Ryohei YAMAMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD AND WAFER PRODUCING APPARATUS

    • Publication number 20200343102
    • Publication date Oct 29, 2020
    • Disco Corporation
    • Kazuya HIRATA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD

    • Publication number 20200156190
    • Publication date May 21, 2020
    • Disco Corporation
    • Ryohei YAMAMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WAFER PRODUCING METHOD AND LASER PROCESSING APPARATUS

    • Publication number 20200086426
    • Publication date Mar 19, 2020
    • Disco Corporation
    • Ryohei Yamamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PRODUCING WAFER

    • Publication number 20190304769
    • Publication date Oct 3, 2019
    • Disco Corporation
    • Kazuya HIRATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PRODUCING WAFER AND APPARATUS FOR PRODUCING WAFER

    • Publication number 20190304800
    • Publication date Oct 3, 2019
    • Disco Corporation
    • Ryohei YAMAMOTO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PRODUCING WAFER AND APPARATUS FOR PRODUCING WAFER

    • Publication number 20190287801
    • Publication date Sep 19, 2019
    • Disco Corporation
    • Ryohei YAMAMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PRODUCING METHOD AND WAFER PRODUCING APPARATUS

    • Publication number 20190228980
    • Publication date Jul 25, 2019
    • Disco Corporation
    • Ryohei Yamamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PEELING APPARATUS

    • Publication number 20190160804
    • Publication date May 30, 2019
    • Disco Corporation
    • Kazuyuki HINOHARA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PEELING APPARATUS

    • Publication number 20190160708
    • Publication date May 30, 2019
    • Disco Corporation
    • Kazuyuki HINOHARA
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Application

    WAFER PRODUCING METHOD AND WAFER PRODUCING APPARATUS

    • Publication number 20190148164
    • Publication date May 16, 2019
    • Disco Corporation
    • Kazuya HIRATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR INGOT INSPECTING METHOD AND APPARATUS, AND LASER PROC...

    • Publication number 20180254223
    • Publication date Sep 6, 2018
    • Disco Corporation
    • Kazuya Hirata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SiC WAFER PRODUCING METHOD

    • Publication number 20180229331
    • Publication date Aug 16, 2018
    • Disco Corporation
    • Kazuya Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING APPARATUS

    • Publication number 20180214976
    • Publication date Aug 2, 2018
    • Disco Corporation
    • Kentaro Iizuka
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PRODUCING SiC WAFER

    • Publication number 20180056440
    • Publication date Mar 1, 2018
    • Disco Corporation
    • Ryohei Yamamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    IMAGE PROCESSING APPARATUS, MEASURING APPARATUS, IMAGE PROCESSING S...

    • Publication number 20170186178
    • Publication date Jun 29, 2017
    • CASIO COMPUTER CO., LTD.
    • Tomoaki NAGASAKA
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    EXERCISE SUPPORT DEVICE, EXERCISE SUPPORT METHOD AND EXERCISE SUPPO...

    • Publication number 20160367853
    • Publication date Dec 22, 2016
    • CASIO COMPUTER CO., LTD.
    • Masayuki HIROHAMA
    • A63 - SPORTS GAMES AMUSEMENTS
  • Information Patent Application

    EXERCISE SUPPORT DEVICE, EXERCISE SUPPORT METHOD AND STORAGE MEDIUM

    • Publication number 20160081612
    • Publication date Mar 24, 2016
    • CASIO COMPUTER CO., LTD.
    • Ryohei YAMAMOTO
    • A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
  • Information Patent Application

    MEASUREMENT APPARATUS, MEASUREMENT METHOD AND NON-TRANSITORY COMPUT...

    • Publication number 20160061859
    • Publication date Mar 3, 2016
    • CASIO COMPUTER CO., LTD.
    • Mitsuyasu NAKAJIMA
    • G01 - MEASURING TESTING