Ryohta SASAKI

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Oyama-shi, Tochigi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Metal-clad laminate, printed wiring board and semiconductor package
- Patent number 11,497,117
- Issue date Nov 8, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuji Tosaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing FRP precursor and method for manufacturing...
- Patent number 11,446,845
- Issue date Sep 20, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Ryohta Sasaki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed wiring board and semiconductor package
- Patent number 11,040,517
- Issue date Jun 22, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Takeshi Saitoh
- B32 - LAYERED PRODUCTS
Information Patent Grant
Prepreg, printed circuit board, semiconductor package, and method f...
- Patent number 10,856,423
- Issue date Dec 1, 2020
- SHOWA DENKO MATERIALS CO., LTD.
- Yuji Tosaka
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING FRP PRECURSOR AND METHOD FOR MANUFACTURING...
- Publication number 20200376715
- Publication date Dec 3, 2020
- Hitachi Chemical Company, Ltd.
- Ryohta SASAKI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20200323078
- Publication date Oct 8, 2020
- Hitachi Chemical Company, Ltd.
- Yuji TOSAKA
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20190315094
- Publication date Oct 17, 2019
- Hitachi Chemical Company, Ltd.
- Takeshi SAITOH
- B32 - LAYERED PRODUCTS
Information Patent Application
FRP PRECURSOR, LAMINATED PLATE, METAL-CLAD LAMINATE, PRINTED CIRCUI...
- Publication number 20190037691
- Publication date Jan 31, 2019
- Hitachi Chemical Company, Ltd.
- Yuji TOSAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG, PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, AND METHOD F...
- Publication number 20190021175
- Publication date Jan 17, 2019
- Hitachi Chemical Company, Ltd.
- Yuji TOSAKA
- B32 - LAYERED PRODUCTS