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Ryoichi Ikezawa
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Ibaraki, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Epoxy resin molding material for sealing and electronic component d...
Patent number
10,662,315
Issue date
May 26, 2020
Hitachi Chemical Company, Ltd.
Mitsuyoshi Hamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulant of epoxy resin, curing agent, and secondary aminosilane...
Patent number
7,544,727
Issue date
Jun 9, 2009
Hitachi Chemical Co., Ltd.
Ryoichi Ikezawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Epoxy resin molding material for sealing use and semiconductor device
Patent number
7,397,139
Issue date
Jul 8, 2008
Hitachi Chemical Co., Ltd.
Ryoichi Ikezawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive composition for metal-clad laminates
Patent number
5,066,691
Issue date
Nov 19, 1991
Hitachi Chemical Co., Ltd.
Toshihisa Kumakura
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Patents Applications
last 30 patents
Information
Patent Application
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...
Publication number
20170121505
Publication date
May 4, 2017
Hitachi Chemical Company, Ltd.
Mitsuyoshi Hamada
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
EPOXY RESIN MOLDING MATERIAL FOR SEALING AND ELECTRONIC COMPONENT D...
Publication number
20140128505
Publication date
May 8, 2014
HITACHI CHEMICAL COMPANY, LTD.
Mitsuyoshi Hamada
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT...
Publication number
20090143511
Publication date
Jun 4, 2009
HITACHI CHEMICAL CO., Ltd.
Ryoichi Ikezawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
Publication number
20090137717
Publication date
May 28, 2009
Ryoichi Ikezawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Epoxy Resin Composition for Sealing and Electronic Component Device
Publication number
20090062430
Publication date
Mar 5, 2009
Ryoichi Ikezawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Encapsulated Epoxy-Resin Molding Compound, And Electronic Component...
Publication number
20080039556
Publication date
Feb 14, 2008
HITACHI CHEMICAL CO., Ltd.
Ryoichi Ikezawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Epoxy resin molding material for sealing use and semiconductor device
Publication number
20060214153
Publication date
Sep 28, 2006
Ryoichi Ikezawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Encapsulating epoxy resin molding material and semiconductor device
Publication number
20060074150
Publication date
Apr 6, 2006
Ryoichi Ikezawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Encapsulating epoxy resin composition, and electronic parts device...
Publication number
20060014873
Publication date
Jan 19, 2006
Ryoichi Ikezawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Encapsulating epoxy resin composition, and electronic parts device...
Publication number
20050222300
Publication date
Oct 6, 2005
Ryoichi Ikezawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Epoxy resin molding material for sealing
Publication number
20030201548
Publication date
Oct 30, 2003
Ryoichi Ikezawa
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...