Ryoichi KAJIWARA

Person

Chiyoda-ku, Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal-resin composite, method for producing the same, busbar, modul...
- Patent number 9,209,044
- Issue date Dec 8, 2015
- Hitachi, Ltd.
- Ryoichi Kajiwara
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,177,833
- Issue date Nov 3, 2015
- Renesas Electronics Corporation
- Takuya Nakajo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring material and semiconductor module using the same
- Patent number 8,975,747
- Issue date Mar 10, 2015
- Hitachi, Ltd.
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mosfet package
- Patent number 8,816,411
- Issue date Aug 26, 2014
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus, manufacturing method of semiconductor appa...
- Patent number 8,643,185
- Issue date Feb 4, 2014
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enameled insulated wire and manufacturing method thereof
- Patent number 8,629,352
- Issue date Jan 14, 2014
- Hitachi Cable, Ltd.
- Yoshiyuki Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,492,202
- Issue date Jul 23, 2013
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mosfet package
- Patent number 8,455,986
- Issue date Jun 4, 2013
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method for resin-encapsulated semiconductor device
- Patent number 8,313,983
- Issue date Nov 20, 2012
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,314,484
- Issue date Nov 20, 2012
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering silver paste material and method for bonding semiconducto...
- Patent number 8,303,854
- Issue date Nov 6, 2012
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 8,183,607
- Issue date May 22, 2012
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MOSFET package
- Patent number 7,985,991
- Issue date Jul 26, 2011
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-resin-boned structured body and resin-encapsulated semiconduc...
- Patent number 7,964,975
- Issue date Jun 21, 2011
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-temperature solder, high-temperature solder paste and power se...
- Patent number 7,879,455
- Issue date Feb 1, 2011
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor apparatus and manufacturing method of semiconductor a...
- Patent number 7,816,780
- Issue date Oct 19, 2010
- Renesas Electronics Corporation
- Ryoichi Kajiwara
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power semiconductor module
- Patent number 7,608,917
- Issue date Oct 27, 2009
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MOSFET package
- Patent number 7,400,002
- Issue date Jul 15, 2008
- Renesas Technology Corp.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MOSFET package
- Patent number 7,394,146
- Issue date Jul 1, 2008
- Renesas Tehcnology Corp.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MOSFET package
- Patent number 7,342,267
- Issue date Mar 11, 2008
- Renesas Technology Corp.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MOSFET package
- Patent number 7,332,757
- Issue date Feb 19, 2008
- Renesas Technology Corp.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip assembly structure for semiconductor device and method of...
- Patent number 6,798,072
- Issue date Sep 28, 2004
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,784,554
- Issue date Aug 31, 2004
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,774,466
- Issue date Aug 10, 2004
- Renesas Technology Corp.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor package by attaching a lead...
- Patent number 6,569,764
- Issue date May 27, 2003
- Hitachi, Ltd.
- Toshinori Hirashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding method and ultrasonic bonding apparatus
- Patent number 5,884,835
- Issue date Mar 23, 1999
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding apparatus and quality monitoring method
- Patent number 5,431,324
- Issue date Jul 11, 1995
- Hitachi, Ltd.
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and testing apparatus of a bonded portion
- Patent number 5,323,952
- Issue date Jun 28, 1994
- Hitachi, Ltd.
- Mituo Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and cooling device of the same
- Patent number 4,996,589
- Issue date Feb 26, 1991
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 4,809,058
- Issue date Feb 28, 1989
- Hitachi, Ltd.
- Takao Funamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL-RESIN COMPOSITE, METHOD FOR PRODUCING THE SAME, BUSBAR, MODUL...
- Publication number 20160010213
- Publication date Jan 14, 2016
- Hitachi, Ltd
- Ryoichi Kajiwara
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Vehicle-Mounted Electronic Module
- Publication number 20150366086
- Publication date Dec 17, 2015
- Hitachi Automotive Systems, Ltd.
- Ryoichi KAJIWARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20140264383
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING MATERIAL AND SEMICONDUCTOR MODULE USING THE SAME
- Publication number 20140191399
- Publication date Jul 10, 2014
- Hitachi, Ltd.
- Takashi Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130264696
- Publication date Oct 10, 2013
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130228907
- Publication date Sep 5, 2013
- RENESAS ELECTRONICS CORPORATION
- Takuya NAKAJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130071971
- Publication date Mar 21, 2013
- RENESAS ELECTRONICS CORPORATION
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120217556
- Publication date Aug 30, 2012
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-RESIN COMPOSITE, METHOD FOR PRODUCING THE SAME, BUSBAR, MODUL...
- Publication number 20120141818
- Publication date Jun 7, 2012
- Hitachi, Ltd.
- Ryoichi KAJIWARA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110298020
- Publication date Dec 8, 2011
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTO...
- Publication number 20110290863
- Publication date Dec 1, 2011
- Ryoichi KAJIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION METHOD FOR RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE
- Publication number 20110223720
- Publication date Sep 15, 2011
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENAMELED INSULATED WIRE AND MANUFANTURING METHOD THEREOF
- Publication number 20110024156
- Publication date Feb 3, 2011
- HITACHI CABLE, LTD.
- Yoshiyuki Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100187678
- Publication date Jul 29, 2010
- Renesas Technology Corp.
- Ryoichi KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal-resin-boned structured body and resin-encapsulated semiconduc...
- Publication number 20090197375
- Publication date Aug 6, 2009
- Hitachi, Ltd.
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR APPARATUS, MANUFACTURING METHOD OF SEMICONDUCTOR APPA...
- Publication number 20090096100
- Publication date Apr 16, 2009
- Ryoichi KAJIWARA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080169537
- Publication date Jul 17, 2008
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor apparatus and manufacturing method of semiconductor a...
- Publication number 20080145607
- Publication date Jun 19, 2008
- Renesas Technology Corp.
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module
- Publication number 20070267739
- Publication date Nov 22, 2007
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High-temperature solder, high-temperature solder paste and power se...
- Publication number 20070125449
- Publication date Jun 7, 2007
- Ryoichi Kajiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20070040249
- Publication date Feb 22, 2007
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20070040250
- Publication date Feb 22, 2007
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20070040248
- Publication date Feb 22, 2007
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20070029540
- Publication date Feb 8, 2007
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20060197196
- Publication date Sep 7, 2006
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20060197200
- Publication date Sep 7, 2006
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20040217474
- Publication date Nov 4, 2004
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20040150082
- Publication date Aug 5, 2004
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030127747
- Publication date Jul 10, 2003
- Ryoichi Kajiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package and flip chip bonding method therein
- Publication number 20030001286
- Publication date Jan 2, 2003
- Ryoichi Kajiwara
- H01 - BASIC ELECTRIC ELEMENTS

Ryoichi KAJIWARA

Person

Patents Grantslast 30 patents

Metal-resin composite, method for producing the same, busbar, modul...

Semiconductor device and method of manufacturing the same

Wiring material and semiconductor module using the same

Mosfet package

Semiconductor apparatus, manufacturing method of semiconductor appa...

Enameled insulated wire and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Mosfet package

Fabrication method for resin-encapsulated semiconductor device

Semiconductor device and method of manufacturing the same

Sintering silver paste material and method for bonding semiconducto...

Semiconductor device

MOSFET package

Metal-resin-boned structured body and resin-encapsulated semiconduc...

High-temperature solder, high-temperature solder paste and power se...

Semiconductor apparatus and manufacturing method of semiconductor a...

Power semiconductor module

MOSFET package

MOSFET package

MOSFET package

MOSFET package

Flip chip assembly structure for semiconductor device and method of...

Semiconductor device and manufacturing method thereof

Semiconductor device

Method of manufacturing a semiconductor package by attaching a lead...

Ultrasonic bonding method and ultrasonic bonding apparatus

Ultrasonic bonding apparatus and quality monitoring method

Bonding apparatus and testing apparatus of a bonded portion

Semiconductor module and cooling device of the same

Integrated circuit device

Patents Applicationslast 30 patents

METAL-RESIN COMPOSITE, METHOD FOR PRODUCING THE SAME, BUSBAR, MODUL...

Vehicle-Mounted Electronic Module

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

WIRING MATERIAL AND SEMICONDUCTOR MODULE USING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

METAL-RESIN COMPOSITE, METHOD FOR PRODUCING THE SAME, BUSBAR, MODUL...

SEMICONDUCTOR DEVICE

SINTERING SILVER PASTE MATERIAL AND METHOD FOR BONDING SEMICONDUCTO...

FABRICATION METHOD FOR RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE

ENAMELED INSULATED WIRE AND MANUFANTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Metal-resin-boned structured body and resin-encapsulated semiconduc...

SEMICONDUCTOR APPARATUS, MANUFACTURING METHOD OF SEMICONDUCTOR APPA...

SEMICONDUCTOR DEVICE

Semiconductor apparatus and manufacturing method of semiconductor a...

Power Semiconductor Module

High-temperature solder, high-temperature solder paste and power se...

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor package and flip chip bonding method therein