Ryoichi Oguro

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing electrolytic copper foil
- Patent number 11,773,501
- Issue date Oct 3, 2023
- TEX TECHNOLOGY INC.
- Ryoichi Oguro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of surface-roughening treatment of copper foil
- Patent number 5,792,333
- Issue date Aug 11, 1998
- Circuit Foil Japan Co., Ltd.
- Ryoichi Oguro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Both-side roughened copper foil with protection film
- Patent number 5,413,838
- Issue date May 9, 1995
- Sumitomo Bakelite Company Limited
- Keiji Azuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil for inner layer circuit of multi-layered printed circui...
- Patent number 5,320,919
- Issue date Jun 14, 1994
- Sumitomo Bakelite Company Limited
- Keiji Azuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing copper-clad laminated board
- Patent number 5,286,330
- Issue date Feb 15, 1994
- Sumitomo Bakelite Company Limited
- Keiji Azuma
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING ELECTROLYTIC COPPER FOIL
- Publication number 20210317590
- Publication date Oct 14, 2021
- TEX TECHNOLOGY INC.
- Ryoichi OGURO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE TREATMENT METHOD FOR COPPER FOIL, SURFACE-TREATED COPPER FO...
- Publication number 20130071755
- Publication date Mar 21, 2013
- FURUKAWA ELECTRIC CO., LTD.
- Ryoichi Oguro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HEAT-RESISTANT COPPER FOIL AND METHOD OF PRODUCING THE SAME, CIRCUI...
- Publication number 20120205146
- Publication date Aug 16, 2012
- FURUKAWA ELECTRIC CO., LTD.
- Ryoichi Oguro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL WITH RESISTANCE LAYER, METHOD OF PRODUCTION OF THE SAME...
- Publication number 20120111613
- Publication date May 10, 2012
- FURUKAWA ELECTRIC CO., LTD.
- Ryoichi Oguro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR