Ryoichi Shimizu

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Ayase, JP

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for component incorporated substrate and compo...
- Patent number 9,622,352
- Issue date Apr 11, 2017
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate manufacturing method
- Patent number 9,526,182
- Issue date Dec 20, 2016
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a component-embedded substrate
- Patent number 9,320,185
- Issue date Apr 19, 2016
- MEIKO ELECTRONICS CO., LTD.
- Yoshio Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20160118346
- Publication date Apr 28, 2016
- Meiko Electronics Co., Ltd.
- Mitsuaki Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR COMPONENT INCORPORATED SUBSTRATE AND COMPO...
- Publication number 20150237734
- Publication date Aug 20, 2015
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...
- Publication number 20140347835
- Publication date Nov 27, 2014
- Meiko Electronics Co., Ltd.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Component-Embedded Substrate, and Component...
- Publication number 20130242516
- Publication date Sep 19, 2013
- MEIKO ELECTRONICS CO., LTD.
- Yoshio Imamura
- H01 - BASIC ELECTRIC ELEMENTS