Ryoichi UCHIMURA

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Chiyoda-ku, Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Laminate, printed wiring board, semiconductor package, and method f...
- Patent number 11,938,688
- Issue date Mar 26, 2024
- Resonac Corporation
- Noriaki Murakami
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Metal-clad laminate, printed wiring board and semiconductor package
- Patent number 11,497,117
- Issue date Nov 8, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuji Tosaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed wiring board and semiconductor package
- Patent number 11,040,517
- Issue date Jun 22, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Takeshi Saitoh
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD F...
- Publication number 20240173927
- Publication date May 30, 2024
- Resonac Corporation
- Noriaki MURAKAMI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD F...
- Publication number 20220080702
- Publication date Mar 17, 2022
- Showa Denko Materials Co., Ltd.
- Noriaki MURAKAMI
- B32 - LAYERED PRODUCTS
Information Patent Application
METAL-CLAD LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20200323078
- Publication date Oct 8, 2020
- Hitachi Chemical Company, Ltd.
- Yuji TOSAKA
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20190315094
- Publication date Oct 17, 2019
- Hitachi Chemical Company, Ltd.
- Takeshi SAITOH
- B32 - LAYERED PRODUCTS