Ryoichi Watanabe

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Fabricating method for multilayer printed circuit board
- Patent number 8,574,444
- Issue date Nov 5, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Ryoichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabricating method for multilayer printed circuit board
- Patent number 8,262,917
- Issue date Sep 11, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ryoichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FABRICATING METHOD FOR MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20120308718
- Publication date Dec 6, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ryoichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating a circuit board
- Publication number 20090053897
- Publication date Feb 26, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Ryoichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabricating method for multilayer printed circuit board
- Publication number 20090014411
- Publication date Jan 15, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Ryoichi Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR