Ryoichi Yoshifuku

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,989,283
- Issue date Aug 2, 2011
- Renesas Electronics Corporation
- Shinichi Yamanari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having trench element-...
- Patent number 6,825,118
- Issue date Nov 30, 2004
- Renesas Technology Corp.
- Takahiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring layer dry etching method and semiconductor device manufactur...
- Patent number 6,740,598
- Issue date May 25, 2004
- Renesas Technology Corp.
- Kenji Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,651,678
- Issue date Nov 25, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kenji Shintani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20110081753
- Publication date Apr 7, 2011
- Renesas Electronics Corporation
- Shinichi YAMANARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING TRENCH ELEMENT-...
- Publication number 20040097046
- Publication date May 20, 2004
- Renesas Technology Coporation
- Takahiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20030096505
- Publication date May 22, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kenji Shintani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring layer dry etching method, semiconductor device manufacturing...
- Publication number 20020173150
- Publication date Nov 21, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Kenji Kawai
- H01 - BASIC ELECTRIC ELEMENTS