TREA

Ryosuke FUKUDA

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  • Kyoto-shi, Kyoto, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor module
    • Patent number 12,224,231
    • Issue date Feb 11, 2025
    • Rohm Co., Ltd.
    • Kenji Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 12,191,237
    • Issue date Jan 7, 2025
    • Rohm Co., Ltd.
    • Kenji Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 12,068,230
    • Issue date Aug 20, 2024
    • Rohm Co., Ltd.
    • Kohei Tanikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 12,057,426
    • Issue date Aug 6, 2024
    • Rohm Co., Ltd.
    • Kenji Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 11,961,790
    • Issue date Apr 16, 2024
    • Rohm Co., Ltd.
    • Kenji Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 11,955,414
    • Issue date Apr 9, 2024
    • Rohm Co., Ltd.
    • Kohei Tanikawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 11,955,451
    • Issue date Apr 9, 2024
    • Rohm Co., Ltd.
    • Kenji Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 11,955,452
    • Issue date Apr 9, 2024
    • Rohm Co., Ltd.
    • Kenji Hayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor module
    • Patent number 11,955,413
    • Issue date Apr 9, 2024
    • Rohm Co., Ltd.
    • Kohei Tanikawa
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240413060
    • Publication date Dec 12, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240371735
    • Publication date Nov 7, 2024
    • ROHM CO., LTD.
    • Kohei TANIKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240321811
    • Publication date Sep 26, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240243044
    • Publication date Jul 18, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240234265
    • Publication date Jul 11, 2024
    • ROHM CO., LTD.
    • Kohei TANIKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240234267
    • Publication date Jul 11, 2024
    • Rohm Co., Ltd.
    • Shinya UMEKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE FOR SEMICONDUCTOR DEVICE
    • Publication number 20240203849
    • Publication date Jun 20, 2024
    • ROHM CO., LTD.
    • Ryosuke FUKUDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240170441
    • Publication date May 23, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240030112
    • Publication date Jan 25, 2024
    • ROHM CO., LTD.
    • Hiroto SAKAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230411339
    • Publication date Dec 21, 2023
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230402421
    • Publication date Dec 14, 2023
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230395475
    • Publication date Dec 7, 2023
    • ROHM CO., LTD.
    • Kohei TANIKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230395474
    • Publication date Dec 7, 2023
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230395476
    • Publication date Dec 7, 2023
    • ROHM CO., LTD.
    • Kohei TANIKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230343755
    • Publication date Oct 26, 2023
    • Rohm Co., Ltd.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230307411
    • Publication date Sep 28, 2023
    • Rohm Co., Ltd.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230299036
    • Publication date Sep 21, 2023
    • Rohm Co., Ltd.
    • Takumi KANDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230245960
    • Publication date Aug 3, 2023
    • Rohm Co., Ltd.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20230245961
    • Publication date Aug 3, 2023
    • Rohm Co., Ltd.
    • Kohei TANIKAWA
    • H01 - BASIC ELECTRIC ELEMENTS