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Ryosuke Nishihara

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wafer and method of processing wafer
    • Patent number 10,115,578
    • Issue date Oct 30, 2018
    • Disco Corporation
    • Ryosuke Nishihara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer processing method
    • Patent number 9,786,509
    • Issue date Oct 10, 2017
    • Disco Corporation
    • Ryosuke Nishihara
    • B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER AND METHOD OF PROCESSING WAFER
    • Publication number 20180076016
    • Publication date Mar 15, 2018
    • Disco Corporation
    • Ryosuke Nishihara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD
    • Publication number 20160064230
    • Publication date Mar 3, 2016
    • Disco Corporation
    • Ryosuke Nishihara
    • H01 - BASIC ELECTRIC ELEMENTS