Ryosuke TAKADA

Person

Nagaokakyo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,036,776
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin substrate and method for manufacturing resin substrate
- Patent number 11,659,652
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated body and method for manufacturing the same
- Patent number 11,558,958
- Issue date Jan 17, 2023
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate, interposer, and electronic device
- Patent number 11,510,315
- Issue date Nov 22, 2022
- Murata Manufacturing Co., Ltd.
- Hiromasa Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated body and method for manufacturing the same
- Patent number 11,445,606
- Issue date Sep 13, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and electronic apparatus
- Patent number 11,266,016
- Issue date Mar 1, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board, electronic device and method for producing...
- Patent number 11,257,779
- Issue date Feb 22, 2022
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate, interposer, and electronic device
- Patent number 11,089,680
- Issue date Aug 10, 2021
- Murata Manufacturing Co., Ltd.
- Hiromasa Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate
- Patent number 10,959,327
- Issue date Mar 23, 2021
- Murata Manufacturing Co., Ltd.
- Shinichi Araki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer and electronic device
- Patent number 10,806,033
- Issue date Oct 13, 2020
- Murata Manufacturing Co., Ltd.
- Kanto Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN SHEET AND RESIN MULTILAYER SUBSTRATE
- Publication number 20240206060
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220377886
- Publication date Nov 24, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SHEET AND RESIN MULTILAYER SUBSTRATE
- Publication number 20220153943
- Publication date May 19, 2022
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING RESIN MULTI...
- Publication number 20220151066
- Publication date May 12, 2022
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE, INTERPOSER, AND ELECTRONIC DEVICE
- Publication number 20210345487
- Publication date Nov 4, 2021
- Murata Manufacturing Co., Ltd.
- Hiromasa KOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING RESIN MULTI...
- Publication number 20210283890
- Publication date Sep 16, 2021
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS
- Publication number 20210267051
- Publication date Aug 26, 2021
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SUBSTRATE AND METHOD FOR MANUFACTURING RESIN SUBSTRATE
- Publication number 20210267045
- Publication date Aug 26, 2021
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210212203
- Publication date Jul 8, 2021
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE, INTERPOSER, AND ELECTRONIC DEVICE
- Publication number 20200245460
- Publication date Jul 30, 2020
- Murata Manufacturing Co., Ltd.
- Hiromasa KOYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND ELECTRONIC DEVICE
- Publication number 20200205289
- Publication date Jun 25, 2020
- Murata Manufacturing Co., Ltd.
- Kanto IIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD, ELECTRONIC DEVICE AND METHOD FOR PRODUCING...
- Publication number 20200091104
- Publication date Mar 19, 2020
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE
- Publication number 20190269010
- Publication date Aug 29, 2019
- Murata Manufacturing Co., Ltd.
- Shinichi ARAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ryosuke TAKADA

Person

Patents Grantslast 30 patents

Resin multilayer substrate and method for manufacturing resin multi...

Resin multilayer substrate and method for manufacturing resin multi...

Resin substrate and method for manufacturing resin substrate

Laminated body and method for manufacturing the same

Multilayer substrate, interposer, and electronic device

Laminated body and method for manufacturing the same

Resin multilayer substrate and electronic apparatus

Multilayer wiring board, electronic device and method for producing...

Multilayer substrate, interposer, and electronic device

Multilayer wiring substrate

Interposer and electronic device

Patents Applicationslast 30 patents

RESIN SHEET AND RESIN MULTILAYER SUBSTRATE

LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME

RESIN SHEET AND RESIN MULTILAYER SUBSTRATE

RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING RESIN MULTI...

MULTILAYER SUBSTRATE, INTERPOSER, AND ELECTRONIC DEVICE

RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING RESIN MULTI...

RESIN MULTILAYER SUBSTRATE AND ELECTRONIC APPARATUS

RESIN SUBSTRATE AND METHOD FOR MANUFACTURING RESIN SUBSTRATE

LAMINATED BODY AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER SUBSTRATE, INTERPOSER, AND ELECTRONIC DEVICE

INTERPOSER AND ELECTRONIC DEVICE

MULTILAYER WIRING BOARD, ELECTRONIC DEVICE AND METHOD FOR PRODUCING...

MULTILAYER WIRING SUBSTRATE