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Ryota MIWA

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  • Kariya-city, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor module
    • Patent number 11,908,778
    • Issue date Feb 20, 2024
    • Denso Corporation
    • Hiroshi Ishino
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20240274511
    • Publication date Aug 15, 2024
    • DENSO CORPORATION
    • HIROTOSHI KUSAMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240038868
    • Publication date Feb 1, 2024
    • DENSO CORPORATION
    • RYOTA MIWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20230138658
    • Publication date May 4, 2023
    • DENSO CORPORATION
    • Emika ABE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE
    • Publication number 20210407892
    • Publication date Dec 30, 2021
    • DENSO CORPORATION
    • Hiroshi ISHINO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210407875
    • Publication date Dec 30, 2021
    • DENSO CORPORATION
    • Ryota MIWA
    • H01 - BASIC ELECTRIC ELEMENTS