Ryouichi Ikezawa

Follow

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sealant epoxy-resin molding material, and electronic component device
- Patent number 7,846,998
- Issue date Dec 7, 2010
- Hitachi Chemical Co., Ltd.
- Seiichi Akagi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Sealant Epoxy-Resin Molding Material, and Electronic Component Device
- Publication number 20080234409
- Publication date Sep 25, 2008
- Hitachi Chemical Co., Ltd.
- Seiichi Akagi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...