Ryoya Terakawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing head, wafer polishing apparatus using the same, and wafer...
- Patent number 11,554,458
- Issue date Jan 17, 2023
- Sumco Corporation
- Yuki Nakano
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing method and apparatus
- Patent number 10,744,616
- Issue date Aug 18, 2020
- Sumco Corporation
- Tomonori Kawasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing apparatus and polishing head used for same
- Patent number 10,710,209
- Issue date Jul 14, 2020
- Sumco Corporation
- Ryoya Terakawa
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing semiconductor wafer
- Patent number 8,784,159
- Issue date Jul 22, 2014
- Sumco Corporation
- Ryoya Terakawa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMIC...
- Publication number 20240278381
- Publication date Aug 22, 2024
- SUMCO CORPORATION
- Ryoya TERAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING HEAD, POLISHING DEVICE AND METHOD OF MANUFACTURING SEMICO...
- Publication number 20240198479
- Publication date Jun 20, 2024
- SUMCO CORPORATION
- Hiroki OTA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF POLISHING SILICON WAFER AND METHOD OF PRODUCING SILICON W...
- Publication number 20240025008
- Publication date Jan 25, 2024
- SUMCO CORPORATION
- Masahiro MURAKAMI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF TRANSFERRING SEMICONDUCTOR WAFER TO POLISHING APPARATUS A...
- Publication number 20230033545
- Publication date Feb 2, 2023
- SUMCO CORPORATION
- Ryoya TERAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING HEAD, POLISHING APPARATUS, AND METHOD OF MANUFACTURING SE...
- Publication number 20220161388
- Publication date May 26, 2022
- SUMCO CORPORATION
- Yuki NAKANO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD, WAFER POLISHING APPARATUS USING THE SAME, AND WAFER...
- Publication number 20210331285
- Publication date Oct 28, 2021
- SUMCO CORPORATION
- Yuki NAKANO
- B24 - GRINDING POLISHING
Information Patent Application
WAFER POLISHING METHOD AND APPARATUS
- Publication number 20200258735
- Publication date Aug 13, 2020
- SUMCO CORPORATION
- Takashi NISHITANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER POLISHING METHOD AND APPARATUS
- Publication number 20180369985
- Publication date Dec 27, 2018
- SUMCO CORPORATION
- Tomonori KAWASAKI
- B24 - GRINDING POLISHING
Information Patent Application
WAFER POLISHING APPARATUS AND POLISHING HEAD USED FOR SAME
- Publication number 20180311783
- Publication date Nov 1, 2018
- SUMCO CORPORATION
- Ryoya TERAKAWA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING SEMICONDUCTOR WAFER
- Publication number 20120208439
- Publication date Aug 16, 2012
- SUMCO CORPORATION
- Ryoya Terakawa
- B24 - GRINDING POLISHING

Ryoya Terakawa

Person

Patents Grantslast 30 patents

Polishing head, wafer polishing apparatus using the same, and wafer...

Wafer polishing method and apparatus

Wafer polishing apparatus and polishing head used for same

Method for polishing semiconductor wafer

Patents Applicationslast 30 patents

POLISHING HEAD, POLISHING DEVICE, AND METHOD OF MANUFACTURING SEMIC...

POLISHING HEAD, POLISHING DEVICE AND METHOD OF MANUFACTURING SEMICO...

METHOD OF POLISHING SILICON WAFER AND METHOD OF PRODUCING SILICON W...

METHOD OF TRANSFERRING SEMICONDUCTOR WAFER TO POLISHING APPARATUS A...

POLISHING HEAD, POLISHING APPARATUS, AND METHOD OF MANUFACTURING SE...

POLISHING HEAD, WAFER POLISHING APPARATUS USING THE SAME, AND WAFER...

WAFER POLISHING METHOD AND APPARATUS

WAFER POLISHING METHOD AND APPARATUS

WAFER POLISHING APPARATUS AND POLISHING HEAD USED FOR SAME

METHOD FOR POLISHING SEMICONDUCTOR WAFER