TREA

Ryu MIYAMOTO

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate processing apparatus
    • Patent number 12,020,954
    • Issue date Jun 25, 2024
    • Ebara Corporation
    • Hirotaka Ohashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Plating method and plating apparatus
    • Patent number 11,447,885
    • Issue date Sep 20, 2022
    • Ebara Corporation
    • Jumpei Fujikata
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Plating method and plating apparatus
    • Patent number 10,865,492
    • Issue date Dec 15, 2020
    • Ebara Corporation
    • Jumpei Fujikata
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE PROCESSING APPARATUS
    • Publication number 20210391190
    • Publication date Dec 16, 2021
    • Hirotaka Ohashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATING METHOD AND PLATING APPARATUS
    • Publication number 20210062354
    • Publication date Mar 4, 2021
    • EBARA CORPORATION
    • Jumpei FUJIKATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PLATING METHOD AND PLATING APPARATUS
    • Publication number 20180282892
    • Publication date Oct 4, 2018
    • EBARA CORPORATION
    • Jumpei FUJIKATA
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR