Ryu NAGAI

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Miyagi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Analysis device and analysis method
- Patent number 12,072,693
- Issue date Aug 27, 2024
- Tokyo Electron Limited
- Koki Tanaka
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240071723
- Publication date Feb 29, 2024
- TOKYO ELECTRON LIMITED
- Ryutaro SUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20230170189
- Publication date Jun 1, 2023
- TOKYO ELECTRON LIMITED
- Takashi KAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM, INFORMATION PROCESSING APPARATUS, AND...
- Publication number 20230115942
- Publication date Apr 13, 2023
- TOKYO ELECTRON LIMITED
- Shuhei AKAHANE
- G05 - CONTROLLING REGULATING
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230100292
- Publication date Mar 30, 2023
- TOKYO ELECTRON LIMITED
- KYURI MOTOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20220093367
- Publication date Mar 24, 2022
- TOKYO ELECTRON LIMITED
- Koki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANALYSIS DEVICE, PLASMA PROCESS CONTROL SYSTEM, AND RECORDING MEDIUM
- Publication number 20220075358
- Publication date Mar 10, 2022
- TOKYO ELECTRON LIMITED
- Ryu NAGAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANALYSIS DEVICE AND ANALYSIS METHOD
- Publication number 20210312610
- Publication date Oct 7, 2021
- TOKYO ELECTRON LIMITED
- Koki TANAKA
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

Analysis device and analysis method

Patents Applicationslast 30 patents

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

SUBSTRATE PROCESSING SYSTEM, INFORMATION PROCESSING APPARATUS, AND...

PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

ANALYSIS DEVICE, PLASMA PROCESS CONTROL SYSTEM, AND RECORDING MEDIUM

ANALYSIS DEVICE AND ANALYSIS METHOD