Ryuhei YOKOTA

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epoxy resin composition for semiconductor encapsulation and semicon...
- Patent number 12,305,036
- Issue date May 20, 2025
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-encapsulating epoxy resin composition and semiconduct...
- Patent number 10,851,261
- Issue date Dec 1, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroki Oishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor encapsulation resin composition and semiconductor dev...
- Patent number 9,633,921
- Issue date Apr 25, 2017
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20240263004
- Publication date Aug 8, 2024
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED S...
- Publication number 20230399467
- Publication date Dec 14, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroki HORIGOME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20230312909
- Publication date Oct 5, 2023
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE
- Publication number 20220372274
- Publication date Nov 24, 2022
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20210024749
- Publication date Jan 28, 2021
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...
- Publication number 20210002474
- Publication date Jan 7, 2021
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION AND SEMICONDUCT...
- Publication number 20190309184
- Publication date Oct 10, 2019
- Shin-Etsu Chemical Co., Ltd.
- Hiroki Oishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Encapsulating Resin Composition and Semiconductor Device
- Publication number 20190127580
- Publication date May 2, 2019
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEV...
- Publication number 20160336246
- Publication date Nov 17, 2016
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR ELEMENT AND A S...
- Publication number 20160251511
- Publication date Sep 1, 2016
- Shin-Etsu Chemical Co., Ltd.
- Shoichi OSADA
- H01 - BASIC ELECTRIC ELEMENTS

Ryuhei YOKOTA

Person

Patents Grantslast 30 patents

Epoxy resin composition for semiconductor encapsulation and semicon...

Semiconductor-encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulation resin composition and semiconductor dev...

Patents Applicationslast 30 patents

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR ELEMENT-MOUNTED S...

THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

RESIN COMPOSITION FOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICON...

SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN COMPOSITION AND SEMICONDUCT...

Semiconductor Encapsulating Resin Composition and Semiconductor Device

SEMICONDUCTOR ENCAPSULATION RESIN COMPOSITION AND SEMICONDUCTOR DEV...

RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR ELEMENT AND A S...