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Ryuichi ISHII

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  • Chiyoda-ku, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Power semiconductor device and method for manufacturing power semic...
    • Patent number 12,232,300
    • Issue date Feb 18, 2025
    • Mitsubishi Electric Corporation
    • Noriyuki Besshi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device resistant to thermal cracking and manufacturin...
    • Patent number 11,581,247
    • Issue date Feb 14, 2023
    • Mitsubishi Electric Corporation
    • Ryuichi Ishii
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device with a metal plate
    • Patent number 11,569,148
    • Issue date Jan 31, 2023
    • Mitsubishi Electric Corporation
    • Koki Hayakashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power module
    • Patent number 11,430,721
    • Issue date Aug 30, 2022
    • Mitsubishi Electric Corporation
    • Hiroshi Gokan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power conversion unit
    • Patent number 11,088,649
    • Issue date Aug 10, 2021
    • Mitsubishi Electric Corporation
    • Yasuhiko Kitamura
    • B60 - VEHICLES IN GENERAL
  • Information Patent Grant

    Semiconductor device and method for manufacturing thereof
    • Patent number 10,937,725
    • Issue date Mar 2, 2021
    • Mitsubishi Electric Corporation
    • Yuya Muramatsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power semiconductor device
    • Patent number 10,727,189
    • Issue date Jul 28, 2020
    • Mitsubishi Electric Corporation
    • Noriyuki Besshi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power semiconductor device
    • Patent number 10,553,559
    • Issue date Feb 4, 2020
    • Mitsubishi Electric Corporation
    • Noriyuki Besshi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power semiconductor device
    • Patent number 10,403,559
    • Issue date Sep 3, 2019
    • Mitsubishi Electric Corporation
    • Masaru Fuku
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Molded resin-sealed power semiconductor device
    • Patent number 10,242,930
    • Issue date Mar 26, 2019
    • Mitsubishi Electric Corporation
    • Ryuichi Ishii
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electric power converter and power module
    • Patent number 10,186,501
    • Issue date Jan 22, 2019
    • Mitsubishi Electric Corporation
    • Ryuichi Ishii
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Semiconductor device
    • Patent number 9,018,756
    • Issue date Apr 28, 2015
    • Mitsubishi Electric Corporation
    • Ryuichi Ishii
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Reactor
    • Patent number 8,653,924
    • Issue date Feb 18, 2014
    • Mitsubishi Electric Corporation
    • Masaru Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20250183117
    • Publication date Jun 5, 2025
    • Mitsubishi Electric Corporation
    • Kazuki ARATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20250149413
    • Publication date May 8, 2025
    • MITSUBISHI ELECTRIC CORPORATION
    • Takayuki YAMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
    • Publication number 20230378033
    • Publication date Nov 23, 2023
    • Mitsubishi Electric Corporation
    • Kazuki ARATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN-SEALED SEMICONDUCTOR DEVICE
    • Publication number 20230223317
    • Publication date Jul 13, 2023
    • Mitsubishi Electric Corporation
    • Ryuichi ISHII
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Terminal Member, Assembly, Semiconductor Device, and Methods for Ma...
    • Publication number 20230187339
    • Publication date Jun 15, 2023
    • MITSUBISHI ELECTRIC CORPORATION
    • Chongfa XIE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING RESI...
    • Publication number 20230132513
    • Publication date May 4, 2023
    • Mitsubishi Electric Corporation
    • Ryuichi ISHII
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20220139803
    • Publication date May 5, 2022
    • Mitsubishi Electric Corporation
    • Koki HAYAKASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    • Publication number 20220115300
    • Publication date Apr 14, 2022
    • Mitsubishi Electric Corporation
    • Ryuichi ISHII
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE
    • Publication number 20210384112
    • Publication date Dec 9, 2021
    • Mitsubishi Electric Corporation
    • Hiroshi GOKAN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER CONVERSION UNIT
    • Publication number 20200195189
    • Publication date Jun 18, 2020
    • Mitsubishi Electric Corporation
    • Yasuhiko KITAMURA
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
    • Publication number 20200105655
    • Publication date Apr 2, 2020
    • MITSUBISHI ELECTRIC CORPORATION
    • Yuya MURAMATSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMIC...
    • Publication number 20190343015
    • Publication date Nov 7, 2019
    • MITSUBISHI ELECTRIC CORPORATION
    • Noriyuki BESSHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE
    • Publication number 20190206811
    • Publication date Jul 4, 2019
    • MITSUBISHI ELECTRIC CORPORATION
    • Noriyuki Besshi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE
    • Publication number 20190074236
    • Publication date Mar 7, 2019
    • Mitsubishi Electric Corporation
    • Masaru FUKU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER SEMICONDUCTOR DEVICE
    • Publication number 20180197838
    • Publication date Jul 12, 2018
    • MITSUBISHI ELECTRIC CORPORATION
    • Noriyuki BESSHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOLDED RESIN-SEALED POWER SEMICONDUCTOR DEVICE
    • Publication number 20180096910
    • Publication date Apr 5, 2018
    • Mitsubishi Electric Corporation
    • Ryuichi ISHII
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRIC POWER CONVERTER AND POWER MODULE
    • Publication number 20160225750
    • Publication date Aug 4, 2016
    • Mitsubishi Electric Corporation
    • Ryuichi ISHII
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20140367845
    • Publication date Dec 18, 2014
    • Mitsubishi Electric Corporation
    • Ryuichi ISHII
    • C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
  • Information Patent Application

    REACTOR
    • Publication number 20120139684
    • Publication date Jun 7, 2012
    • Mitsubishi Electric Corporation
    • Masaru KOBAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS