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Ryuichi Kyomasu

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Patents Grantslast 30 patents

  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 6,871,772
    • Issue date Mar 29, 2005
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 6,863,206
    • Issue date Mar 8, 2005
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 6,814,121
    • Issue date Nov 9, 2004
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Transducer and a bonding apparatus using the same
    • Patent number 6,766,936
    • Issue date Jul 27, 2004
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • Information Patent Grant

    Offset measurement method, tool position detection method and bondi...
    • Patent number 6,762,848
    • Issue date Jul 13, 2004
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    XY table for a semiconductor manufacturing apparatus
    • Patent number 6,727,666
    • Issue date Apr 27, 2004
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Transducer and a bonding apparatus using the same
    • Patent number 6,719,183
    • Issue date Apr 13, 2004
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus and method
    • Patent number 6,491,202
    • Issue date Dec 10, 2002
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus and bonding method
    • Patent number 6,467,673
    • Issue date Oct 22, 2002
    • Kabushiki Kaisha Shinkawa
    • Satoshi Enokido
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 6,467,679
    • Issue date Oct 22, 2002
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus and bonding method
    • Patent number 6,464,126
    • Issue date Oct 15, 2002
    • Kabushiki Kaisha Shinkawa
    • Shigeru Hayata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding method and apparatus
    • Patent number 6,449,516
    • Issue date Sep 10, 2002
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ultrasonic horn for a bonding apparatus
    • Patent number 6,422,448
    • Issue date Jul 23, 2002
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 6,189,761
    • Issue date Feb 20, 2001
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Capillary holding structure for ultrasonic horn
    • Patent number 6,135,338
    • Issue date Oct 24, 2000
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 5,486,733
    • Issue date Jan 23, 1996
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 5,411,195
    • Issue date May 2, 1995
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding apparatus
    • Patent number 5,385,288
    • Issue date Jan 31, 1995
    • Kabushiki Kaisha Shinkawa
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of preventing short-circuiting of bonding wires
    • Patent number 5,310,702
    • Issue date May 10, 1994
    • Kulicke and Soffa Industries, Inc.
    • Toshiki Yoshida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Manufacturing method
    • Patent number 4,763,827
    • Issue date Aug 16, 1988
    • Hitachi, Ltd.
    • Kenji Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Manufacturing apparatus
    • Patent number 4,674,670
    • Issue date Jun 23, 1987
    • Hitachi, Ltd.
    • Kenji Watanabe
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 4,347,964
    • Issue date Sep 7, 1982
    • Hitachi, Ltd.
    • Nobuhiro Takasugi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Control circuit for a positioning device using a d-c motor
    • Patent number 4,315,199
    • Issue date Feb 9, 1982
    • Hitachi, Ltd.
    • Ryuichi Kyomasu
    • G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

  • Information Patent Application

    Wire bonding apparatus
    • Publication number 20040007609
    • Publication date Jan 15, 2004
    • KABUSHIKI KAISHA SHINKAWA
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding apparatus
    • Publication number 20030183672
    • Publication date Oct 2, 2003
    • KABUSHIKI KAISHA SHINKAWA
    • Ryuichi Kyomasu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Transducer and a bonding apparatus using the same
    • Publication number 20030047583
    • Publication date Mar 13, 2003
    • KABUSHIKI KAISHA SHINKAWA
    • Ryuichi Kyomasu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bonding apparatus
    • Publication number 20030030821
    • Publication date Feb 13, 2003
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Transducer and a bonding apparatus using the same
    • Publication number 20030000994
    • Publication date Jan 2, 2003
    • KABUSHIKI KAISHA SHINKAWA
    • Ryuichi Kyomasu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    XY table for a semiconductor manufacturing apparatus
    • Publication number 20020180386
    • Publication date Dec 5, 2002
    • Ryuichi Kyomasu
    • G05 - CONTROLLING REGULATING
  • Information Patent Application

    Offset measurement method, tool position detection method and bondi...
    • Publication number 20010042770
    • Publication date Nov 22, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding method
    • Publication number 20010042777
    • Publication date Nov 22, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Ryuichi Kyomasu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Ultrasonic horn for a bonding apparatus
    • Publication number 20010027987
    • Publication date Oct 11, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Ryuichi Kyomasu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Bonding apparatus and bonding method
    • Publication number 20010016062
    • Publication date Aug 23, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Satoshi Enokido
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Bonding apparatus and bonding method
    • Publication number 20010011669
    • Publication date Aug 9, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Shigeru Hayata
    • H01 - BASIC ELECTRIC ELEMENTS