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Ryuichi Matsuki
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Nagano, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Heat radiation component and semiconductor package including same
Patent number
8,674,499
Issue date
Mar 18, 2014
Shinko Electric Industries Co., Ltd.
Kei Murayama
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Method for manufacturing a semiconductor package
Patent number
7,923,302
Issue date
Apr 12, 2011
Shinko Electric Industries Co., Ltd.
Keisuke Ueda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method for manufacturing the same
Patent number
7,619,316
Issue date
Nov 17, 2009
Shinko Electric Industries Co., Ltd.
Keisuke Ueda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ceramic circuit board and semiconductor device using same
Patent number
5,943,212
Issue date
Aug 24, 1999
Shinko Electric Industries Co., Ltd.
Michio Horiuchi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HEAT RADIATION COMPONENT AND SEMICONDUCTOR PACKAGE INCLUDING SAME
Publication number
20110291258
Publication date
Dec 1, 2011
Shinko Electric Industries Co., Ltd.
Kei MURAYAMA
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20100022054
Publication date
Jan 28, 2010
SHINKO ELECTRIC INDUSTRIES, CO., LTD.
Keisuke UEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package and method for manufacturing the same
Publication number
20080128915
Publication date
Jun 5, 2008
Shinko Electric Industries Co., Ltd.
Keisuke Ueda
H01 - BASIC ELECTRIC ELEMENTS