Ryuichi Nakagami

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Ehime, JP

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Patents Grantslast 30 patents

Information Patent Grant
Metal-laminated polyimide substrate, and method for production thereof
- Patent number 10,021,789
- Issue date Jul 10, 2018
- Ebara-Udylite Co., Ltd.
- Shinya Ochi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible printed circuit board and process for producing the same
- Patent number 7,282,255
- Issue date Oct 16, 2007
- Matsushita Electric Industrial Co., Ltd.
- Kouichi Hiranaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL-LAMINATED POLYIMIDE SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF
- Publication number 20100189974
- Publication date Jul 29, 2010
- Shinya Ochi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Flexible printed circuit board and process for producing the same
- Publication number 20050174722
- Publication date Aug 11, 2005
- Matsushita Electric Industrial Co. Ltd.
- Kouichi Hiranaka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR