Ryuichi TAKANO

Person

Kumagaya-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Die bonder and bonding method
- Patent number 9,362,250
- Issue date Jun 7, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Ryuichi Takano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Foreign substance removing device and die bonder equipped with the...
- Patent number 8,783,319
- Issue date Jul 22, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Takashi Yamagami
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 8,703,583
- Issue date Apr 22, 2014
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 7,629,231
- Issue date Dec 8, 2009
- Renesas Technology Corp.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light valve device
- Patent number 6,067,062
- Issue date May 23, 2000
- Seiko Instruments Inc.
- Hiroaki Takasu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor thin film formed on a supporting substrate
- Patent number 5,646,432
- Issue date Jul 8, 1997
- Seiko Instruments Inc.
- Tadao Iwaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light valve device making
- Patent number 5,637,187
- Issue date Jun 10, 1997
- Seiko Instruments Inc.
- Hiroaki Takasu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor substrate having a thin film semiconductor layer bond...
- Patent number 5,459,335
- Issue date Oct 17, 1995
- Seiko Instruments Inc.
- Katsuki Matsushita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INFORMATION PROCESSING APPARATUS, FLOW GENERATION METHOD, AND COMPU...
- Publication number 20230056860
- Publication date Feb 23, 2023
- RICOH COMPANY, LTD.
- Tomoyuki TAZUKE
- G05 - CONTROLLING REGULATING
Information Patent Application
INFORMATION PROCESSING APPARATUS, FLOW GENERATION METHOD, AND COMPU...
- Publication number 20230058327
- Publication date Feb 23, 2023
- RICOH COMPANY, LTD.
- Tomoyuki TAZUKE
- G05 - CONTROLLING REGULATING
Information Patent Application
Die Bonder And Bonding Method
- Publication number 20140069564
- Publication date Mar 13, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Ryuichi TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Foreign Substance Removing Device and Die Bonder Equipped with the...
- Publication number 20120241096
- Publication date Sep 27, 2012
- Hitachi High-Tech Instruments Co., Ltd.
- Takashi YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Method of Semiconductor Device
- Publication number 20100055878
- Publication date Mar 4, 2010
- RENESAS TECHNOLOGY CORP.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20070275544
- Publication date Nov 29, 2007
- RENESAS TECHNOLOGY CORP.
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS

Ryuichi TAKANO

Person

Patents Grantslast 30 patents

Die bonder and bonding method

Foreign substance removing device and die bonder equipped with the...

Fabrication method of semiconductor device

Fabrication method of semiconductor device

Light valve device

Semiconductor thin film formed on a supporting substrate

Light valve device making

Semiconductor substrate having a thin film semiconductor layer bond...

Patents Applicationslast 30 patents

INFORMATION PROCESSING APPARATUS, FLOW GENERATION METHOD, AND COMPU...

INFORMATION PROCESSING APPARATUS, FLOW GENERATION METHOD, AND COMPU...

Die Bonder And Bonding Method

Foreign Substance Removing Device and Die Bonder Equipped with the...

Fabrication Method of Semiconductor Device

FABRICATION METHOD OF SEMICONDUCTOR DEVICE