RYUICHIRO MORI

Person

TOKYO, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plastic-packaged semiconductor device including a plurality of chips
- Patent number 6,369,447
- Issue date Apr 9, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package utilizing a flexible wiring substrate
- Patent number 6,163,070
- Issue date Dec 19, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module comprising semiconductor packages
- Patent number 5,903,049
- Issue date May 11, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device
- Patent number 5,659,199
- Issue date Aug 19, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making resin molded semiconductor device
- Patent number 5,139,969
- Issue date Aug 18, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer controlled automated semiconductor production apparatus
- Patent number 5,042,123
- Issue date Aug 27, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealed semiconductor device
- Patent number 4,942,454
- Issue date Jul 17, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device
- Patent number 4,884,124
- Issue date Nov 28, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding apparatus
- Patent number 4,878,610
- Issue date Nov 7, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 4,857,989
- Issue date Aug 15, 1989
- Mitsubishi Denki Kabushiki Kaisha
- Ryuichiro Mori
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLASTIC-PACKAGED SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF CHIPS
- Publication number 20020000672
- Publication date Jan 3, 2002
- RYUICHIRO MORI
- H01 - BASIC ELECTRIC ELEMENTS

RYUICHIRO MORI

Person

Patents Grantslast 30 patents

Plastic-packaged semiconductor device including a plurality of chips

Semiconductor package utilizing a flexible wiring substrate

Semiconductor module comprising semiconductor packages

Resin sealed semiconductor device

Method of making resin molded semiconductor device

Computer controlled automated semiconductor production apparatus

Resin sealed semiconductor device

Resin-encapsulated semiconductor device

Die bonding apparatus

Semiconductor device

Patents Applicationslast 30 patents

PLASTIC-PACKAGED SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF CHIPS