Ryuji HOSOKAWA

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus
- Patent number 8,759,971
- Issue date Jun 24, 2014
- Kabushiki Kaisha Toshiba
- Ryuji Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a semiconductor element with a...
- Patent number 7,608,911
- Issue date Oct 27, 2009
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device package having a semic...
- Patent number 7,405,159
- Issue date Jul 29, 2008
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of assembling a semiconductor device
- Patent number 7,298,035
- Issue date Nov 20, 2007
- Kabushiki Kaisha Toshiba
- Ryuji Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a semiconductor element with resin
- Patent number 7,202,563
- Issue date Apr 10, 2007
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laminated module
- Patent number 6,734,541
- Issue date May 11, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Shimoe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of folding a strip leadframe to superpose two leadframes in...
- Patent number 5,614,441
- Issue date Mar 25, 1997
- Kabushiki Kaisha Toshiba
- Ryuji Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing resin-sealed semiconductor device, lead fra...
- Patent number 5,543,658
- Issue date Aug 6, 1996
- Kabushiki Kaisha Toshiba
- Ryuji Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20120049355
- Publication date Mar 1, 2012
- Ryuji HOSOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080265443
- Publication date Oct 30, 2008
- KABUSHIKI KAISHA TOSHIBA,
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070196956
- Publication date Aug 23, 2007
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of assembling a semiconductor device
- Publication number 20060055061
- Publication date Mar 16, 2006
- Ryuji Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050212145
- Publication date Sep 29, 2005
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor laminated module
- Publication number 20020190368
- Publication date Dec 19, 2002
- Kabushiki Kaishi Toshiba
- Hiroshi Shimoe
- H01 - BASIC ELECTRIC ELEMENTS

Ryuji HOSOKAWA

Person

Patents Grantslast 30 patents

Semiconductor apparatus

Semiconductor device package having a semiconductor element with a...

Method of fabricating a semiconductor device package having a semic...

Semiconductor device and a method of assembling a semiconductor device

Semiconductor device package having a semiconductor element with resin

Semiconductor laminated module

Process of folding a strip leadframe to superpose two leadframes in...

Method of manufacturing resin-sealed semiconductor device, lead fra...

Patents Applicationslast 30 patents

SEMICONDUCTOR APPARATUS

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and a method of assembling a semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor laminated module