Ryuji Nomoto

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Encapsulated semiconductor chips with wiring including controlling...
- Patent number 9,041,186
- Issue date May 26, 2015
- Fujitsu Semiconductor Limited
- Ryuji Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method of the semiconductor dev...
- Patent number 7,863,745
- Issue date Jan 4, 2011
- Fujitsu Semiconductor Limited
- Ryuji Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 7,456,089
- Issue date Nov 25, 2008
- Fujitsu Limited
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of designing circuit board
- Patent number 7,251,801
- Issue date Jul 31, 2007
- Fujitsu Limited
- Kaname Ozawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device having resin package and method of producing the same
- Patent number 7,144,754
- Issue date Dec 5, 2006
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the semiconductor...
- Patent number 7,122,897
- Issue date Oct 17, 2006
- Fujitsu Limited
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having resin package and method of producing the same
- Patent number 6,856,017
- Issue date Feb 15, 2005
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, method for fabricating the semiconductor devi...
- Patent number 6,573,121
- Issue date Jun 3, 2003
- Fujitsu Limited
- Yoshiyuki Yoneda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonded device with ball-shaped bonds
- Patent number 6,495,773
- Issue date Dec 17, 2002
- Fujitsu Limited
- Ryuji Nomoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having columnar electrode and method of manufa...
- Patent number 6,476,503
- Issue date Nov 5, 2002
- Fujitsu Limited
- Kazuyuki Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for fabricating the semiconductor devi...
- Patent number 6,376,921
- Issue date Apr 23, 2002
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and mounting structure
- Patent number 6,329,711
- Issue date Dec 11, 2001
- Fujitsu Limited
- Toshimi Kawahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 6,288,444
- Issue date Sep 11, 2001
- Fujitsu Limited
- Mitsuo Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a lead portion with outer connecting te...
- Patent number 6,255,740
- Issue date Jul 3, 2001
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 6,215,182
- Issue date Apr 10, 2001
- Fujitsu Limited
- Kaname Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a ball grid array and a fabrication pro...
- Patent number 6,207,477
- Issue date Mar 27, 2001
- Fujitsu Limited
- Toshiyuki Motooka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having resin package with projections
- Patent number 6,072,239
- Issue date Jun 6, 2000
- Fujitsu Limited
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device
- Patent number 5,930,603
- Issue date Jul 27, 1999
- Fujitsu Limited
- Kazuto Tsuji
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wire bonding method, semiconductor device, capillary for wire bondi...
- Patent number 5,842,628
- Issue date Dec 1, 1998
- Fujitsu Limited
- Ryuji Nomoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a semicondutor device having a lead portion wit...
- Patent number 5,656,550
- Issue date Aug 12, 1997
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MODULE AND METHOD OF FAB...
- Publication number 20130299845
- Publication date Nov 14, 2013
- Ryuji Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080197466
- Publication date Aug 21, 2008
- Fujitsu Limited
- Ryuji Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method of the semiconductor dev...
- Publication number 20070284755
- Publication date Dec 13, 2007
- FUJITSU LIMITED
- Ryuji Nomoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the semiconductor...
- Publication number 20070249093
- Publication date Oct 25, 2007
- Fujitsu Limited
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of designing circuit board
- Publication number 20060040532
- Publication date Feb 23, 2006
- FUJITSU LIMITED
- Kaname Ozawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor device and method of manufacturing the semiconductor...
- Publication number 20050253264
- Publication date Nov 17, 2005
- FUJITSU LIMITED
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device having resin package and method of producing the same
- Publication number 20040219719
- Publication date Nov 4, 2004
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DEVICE HAVING RESIN PACKAGE AND METHOD OF PRODUCING THE SAME
- Publication number 20030006503
- Publication date Jan 9, 2003
- YOSHIYUKI YONEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, method for fabricating the semiconductor devi...
- Publication number 20020027265
- Publication date Mar 7, 2002
- FUJITSU LIMITED
- Yoshiyuki Yoneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of producing the same
- Publication number 20010052653
- Publication date Dec 20, 2001
- Mitsuo Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a ball grid array and a fabrication pro...
- Publication number 20010001714
- Publication date May 24, 2001
- FUJITSU LIMITED
- Toshiyuki Motooka
- H01 - BASIC ELECTRIC ELEMENTS

Ryuji Nomoto

Person

Patents Grantslast 30 patents

Encapsulated semiconductor chips with wiring including controlling...

Semiconductor device, manufacturing method of the semiconductor dev...

Semiconductor device and method of manufacturing the semiconductor...

Method of designing circuit board

Device having resin package and method of producing the same

Semiconductor device and method of manufacturing the semiconductor...

Device having resin package and method of producing the same

Semiconductor device, method for fabricating the semiconductor devi...

Wire bonded device with ball-shaped bonds

Semiconductor device having columnar electrode and method of manufa...

Semiconductor device, method for fabricating the semiconductor devi...

Semiconductor device and mounting structure

Semiconductor device and method of producing the same

Semiconductor device having a lead portion with outer connecting te...

Semiconductor device and method for producing the same

Semiconductor device having a ball grid array and a fabrication pro...

Device having resin package with projections

Method for producing a semiconductor device

Wire bonding method, semiconductor device, capillary for wire bondi...

Method of producing a semicondutor device having a lead portion wit...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MODULE AND METHOD OF FAB...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device, manufacturing method of the semiconductor dev...

Semiconductor device and method of manufacturing the semiconductor...

Method of designing circuit board

Semiconductor device and method of manufacturing the semiconductor...

Device having resin package and method of producing the same

DEVICE HAVING RESIN PACKAGE AND METHOD OF PRODUCING THE SAME

Semiconductor device, method for fabricating the semiconductor devi...

Semiconductor device and method of producing the same

Semiconductor device having a ball grid array and a fabrication pro...