Ryuji Norimoto

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method
- Patent number 11,114,342
- Issue date Sep 7, 2021
- Disco Corporation
- Ryuji Norimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dividing method
- Patent number 10,629,487
- Issue date Apr 21, 2020
- Disco Corporation
- Ryuji Norimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dividing wafer into individual devices after forming a re...
- Patent number 7,439,162
- Issue date Oct 21, 2008
- Disco Corporation
- Ryuji Norimoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20190122928
- Publication date Apr 25, 2019
- Disco Corporation
- Ryuji Norimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DIVIDING METHOD
- Publication number 20180114696
- Publication date Apr 26, 2018
- Disco Corporation
- Ryuji Norimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer dividing method
- Publication number 20070123002
- Publication date May 31, 2007
- Ryuji Norimoto
- H01 - BASIC ELECTRIC ELEMENTS