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Ryuji Norimoto
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Tokyo, JP
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last 30 patents
Information
Patent Grant
Wafer processing method
Patent number
11,114,342
Issue date
Sep 7, 2021
Disco Corporation
Ryuji Norimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer dividing method
Patent number
10,629,487
Issue date
Apr 21, 2020
Disco Corporation
Ryuji Norimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of dividing wafer into individual devices after forming a re...
Patent number
7,439,162
Issue date
Oct 21, 2008
Disco Corporation
Ryuji Norimoto
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
WAFER PROCESSING METHOD
Publication number
20190122928
Publication date
Apr 25, 2019
Disco Corporation
Ryuji Norimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER DIVIDING METHOD
Publication number
20180114696
Publication date
Apr 26, 2018
Disco Corporation
Ryuji Norimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer dividing method
Publication number
20070123002
Publication date
May 31, 2007
Ryuji Norimoto
H01 - BASIC ELECTRIC ELEMENTS