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Ryuji Sugiura

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  • Shizuoka, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR WAFER PROCESSING APPARATUS AND METHOD OF MANUFACTURIN...
    • Publication number 20230230829
    • Publication date Jul 20, 2023
    • DENSO CORPORATION
    • SHOSUKE NAKABAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAMINATED ELEMENT MANUFACTURING METHOD
    • Publication number 20220084827
    • Publication date Mar 17, 2022
    • HAMAMATSU PHOTONICS K. K.
    • Takeshi SAKAMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAMINATED ELEMENT MANUFACTURING METHOD
    • Publication number 20210057402
    • Publication date Feb 25, 2021
    • Hamamatsu Photonics K.K.
    • Takeshi SAKAMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAMINATED ELEMENT MANUFACTURING METHOD
    • Publication number 20210057222
    • Publication date Feb 25, 2021
    • Hamamatsu Photonics K.K.
    • Takeshi SAKAMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LAMINATED ELEMENT MANUFACTURING METHOD
    • Publication number 20200176415
    • Publication date Jun 4, 2020
    • Hamamatsu Photonics K.K.
    • Takeshi SAKAMOTO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF CUTTING SEMICONDUCTOR SUBSTRATE
    • Publication number 20130252403
    • Publication date Sep 26, 2013
    • HAMAMATSU PHOTONICS K. K.
    • Fumitsugu Fukuyo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD
    • Publication number 20130068739
    • Publication date Mar 21, 2013
    • Hamamatsu Photonics K.K.
    • Ryuji Sugiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF CUTTING SEMICONDUCTOR SUBSTRATE
    • Publication number 20120329248
    • Publication date Dec 27, 2012
    • HAMAMATSU PHOTONICS K. K.
    • Fumitsugu Fukuyo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER MACHINING DEVICE AND LASER MACHINING METHOD
    • Publication number 20120103948
    • Publication date May 3, 2012
    • Hamamatsu Photonics K.K.
    • Ryuji Sugiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER MACHINING METHOD
    • Publication number 20120091107
    • Publication date Apr 19, 2012
    • Hamamatsu Photonics K.K.
    • Ryuji Sugiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR SUBSTRATE CUTTING METHOD
    • Publication number 20120077315
    • Publication date Mar 29, 2012
    • HAMAMATSU PHOTONICS K. K.
    • Kenshi FUKUMITSU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD AND CHIP
    • Publication number 20120006799
    • Publication date Jan 12, 2012
    • HAMAMATSU PHOTONICS K. K.
    • Ryuji Sugiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF CUTTING SEMICONDUCTOR SUBSTRATE
    • Publication number 20110306182
    • Publication date Dec 15, 2011
    • HAMAMATSU PHOTONICS K. K.
    • Fumitsugu Fukuyo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER BEAM MACHINING METHOD AND SEMICONDUCTOR CHIP
    • Publication number 20110001220
    • Publication date Jan 6, 2011
    • Hamamatsu Photonics K.K.
    • Ryuji Sugiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR SUBSTRATE CUTTING METHOD
    • Publication number 20100203678
    • Publication date Aug 12, 2010
    • HAMAMATSU PHOTONICS K. K.
    • Kenshi FUKUMITSU
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD AND CHIP
    • Publication number 20100184271
    • Publication date Jul 22, 2010
    • HAMAMATSU PHOTONICS K. K.
    • Ryuji Sugiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
    • Publication number 20090261083
    • Publication date Oct 22, 2009
    • Hamamatsu Photonics K. K.
    • Tetsuya Osajima
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser Beam Machining Method And Semiconductor Chip
    • Publication number 20090212396
    • Publication date Aug 27, 2009
    • Ryuji Sugiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser processing method
    • Publication number 20090081851
    • Publication date Mar 26, 2009
    • Takeshi Sakamoto
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Laser processing method and chip
    • Publication number 20080000884
    • Publication date Jan 3, 2008
    • Hamamatsu Photonics K.K.
    • Ryuji Sugiura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor Chip Manufacturing Method, Semiconductor Chip, Semico...
    • Publication number 20070252154
    • Publication date Nov 1, 2007
    • Shoichi Uchiyama
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Semiconductor substrate cutting method
    • Publication number 20070085099
    • Publication date Apr 19, 2007
    • Kenshi Fukumitsu
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method for cutting semiconductor substrate
    • Publication number 20060148212
    • Publication date Jul 6, 2006
    • Fumitsugu Fukuyo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR