Ryuji TSUBAKI

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Kyoto-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding structure of semiconductor device and wire bonding method
- Patent number 9,379,085
- Issue date Jun 28, 2016
- Rohm Co., Ltd.
- Ryuji Tsubaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING STRUCTURE OF SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20110241224
- Publication date Oct 6, 2011
- ROHM CO., LTD.
- Ryuji TSUBAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR