Ryuji UEDA

Person

Kitakatsushika, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal foil pattern layered body, metal foil layered body, metal foi...
- Patent number 10,672,928
- Issue date Jun 2, 2020
- DSM IP Assets B.V.
- Koichi Kumai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of manufacturing a circuit board by punching
- Patent number 10,651,320
- Issue date May 12, 2020
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal foil pattern layered body, metal foil layered body, metal foi...
- Patent number 10,056,517
- Issue date Aug 21, 2018
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a circuit board by punching
- Patent number 9,478,674
- Issue date Oct 25, 2016
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal photoetching product and production method thereof
- Patent number 8,110,344
- Issue date Feb 7, 2012
- Toppan Printing Co., Ltd.
- Ryuji Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal photoetching product and production method thereof
- Patent number 7,498,074
- Issue date Mar 3, 2009
- Toppan Printing Co., Ltd.
- Ryuji Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METAL FOIL PATTERN LAYERED BODY, METAL FOIL LAYERED BODY, METAL FOI...
- Publication number 20170358700
- Publication date Dec 14, 2017
- DSM IP Assets B. V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING
- Publication number 20170018660
- Publication date Jan 19, 2017
- DSM IP Assets B. V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL PATTERN LAYERED BODY, METAL FOIL LAYERED BODY, METAL FOI...
- Publication number 20140090698
- Publication date Apr 3, 2014
- Toppan Printing Co., Ltd.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL PATTERN LAMINATE, METHOD FOR PUNCHING METAL FOIL, CIRCUI...
- Publication number 20130247977
- Publication date Sep 26, 2013
- Toppan Printing Co., Ltd.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal photoetching product and production method thereof
- Publication number 20090081596
- Publication date Mar 26, 2009
- Toppan Printing Co., Ltd.
- Ryuji Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal photo-etching product and production method therefor
- Publication number 20060127690
- Publication date Jun 15, 2006
- Ryuji Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Metal foil pattern layered body, metal foil layered body, metal foi...

Method of manufacturing a circuit board by punching

Metal foil pattern layered body, metal foil layered body, metal foi...

Method of manufacturing a circuit board by punching

Metal photoetching product and production method thereof

Metal photoetching product and production method thereof

Patents Applicationslast 30 patents

METAL FOIL PATTERN LAYERED BODY, METAL FOIL LAYERED BODY, METAL FOI...

METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING

METAL FOIL PATTERN LAYERED BODY, METAL FOIL LAYERED BODY, METAL FOI...

METAL FOIL PATTERN LAMINATE, METHOD FOR PUNCHING METAL FOIL, CIRCUI...

Metal photoetching product and production method thereof

Metal photo-etching product and production method therefor