Ryusuke Kawanaka

Follow

Person

Toyonaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wire for bonding a semiconductor device
- Patent number 4,726,859
- Issue date Feb 23, 1988
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Lead alloy soft solder containing radioactive particles used to mak...
- Patent number 4,512,950
- Issue date Apr 23, 1985
- Mitsubishi Kinzoku Kabushiki Kaisha
- Naoyuki Hosoda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR