Ryuta Mitsusue

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Chiba, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level package and a method of forming a wafer level package
- Patent number 8,729,695
- Issue date May 20, 2014
- Agency for Science, Technology and Research
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrostatic vibrator and electronic apparatus
- Patent number 8,212,325
- Issue date Jul 3, 2012
- Seiko Instruments Inc.
- Fumio Kimura
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
Wafer Level Package and a Method of Forming a Wafer Level Package
- Publication number 20130020713
- Publication date Jan 24, 2013
- Chirayarikathu Veedu Sankarapillai Premachandran
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electrostatic vibrator and electronic apparatus
- Publication number 20110127621
- Publication date Jun 2, 2011
- Fumio Kimura
- H03 - BASIC ELECTRONIC CIRCUITRY