Ryuta OHSUKA

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,144,122
- Issue date Nov 12, 2024
- Sumitomo Electric Industries Ltd.
- Shoichiro Sakai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Printed circuit board and method of manufacturing printed circuit b...
- Patent number 11,013,124
- Issue date May 18, 2021
- Sumitomo Electric Industries, Ltd.
- Ryuta Ohsuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20230232540
- Publication date Jul 20, 2023
- Sumitomo Electric Industries, Ltd.
- Shoichiro SAKAI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
REGENERATING METHOD OF REMOVAL LIQUID AND REGENERATED REMOVAL LIQUID
- Publication number 20230212757
- Publication date Jul 6, 2023
- Sumitomo Electric Industries, Ltd.
- Ryuta OHSUKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
- Publication number 20200260589
- Publication date Aug 13, 2020
- Sumitomo Electric Industries, Ltd.
- Ryuta OHSUKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR