Ryutaro SUDA

Person

  • Miyagi, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Etching method

    • Patent number 12,198,938
    • Issue date Jan 14, 2025
    • Tokyo Electron Limited
    • Takatoshi Orui
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Etching method

    • Patent number 12,142,484
    • Issue date Nov 12, 2024
    • Tokyo Electron Limited
    • Takahiro Yokoyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Substrate processing method and substrate processing system

    • Patent number 11,996,296
    • Issue date May 28, 2024
    • Tokyo Electron Limited
    • Kae Kumagai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Etching method

    • Patent number 11,615,964
    • Issue date Mar 28, 2023
    • Tokyo Electron Limited
    • Takahiro Yokoyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Etching method and plasma processing apparatus

    • Patent number 11,600,501
    • Issue date Mar 7, 2023
    • Tokyo Electron Limited
    • Takahiro Yokoyama
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Etching method

    • Patent number 11,551,937
    • Issue date Jan 10, 2023
    • Tokyo Electron Limited
    • Takahiro Yokoyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Etching method and etching apparatus

    • Patent number 11,482,425
    • Issue date Oct 25, 2022
    • Tokyo Electron Limited
    • Ryutaro Suda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Etching method

    • Patent number 11,456,180
    • Issue date Sep 27, 2022
    • Tokyo Electron Limited
    • Takahiro Yokoyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Etching method

    • Patent number 11,417,530
    • Issue date Aug 16, 2022
    • Tokyo Electron Limited
    • Takahiro Yokoyama
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Substrate processing method and plasma processing apparatus

    • Patent number 11,361,976
    • Issue date Jun 14, 2022
    • Tokyo Electron Limited
    • Ryutaro Suda
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Substrate processing method and substrate processing apparatus

    • Patent number 11,342,194
    • Issue date May 24, 2022
    • Tokyo Electron Limited
    • Ryutaro Suda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method and apparatus for formation of protective sidewall layer for...

    • Patent number 11,171,012
    • Issue date Nov 9, 2021
    • Tokyo Electron Limited
    • Ryutaro Suda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Etching method and etching apparatus

    • Patent number 11,094,550
    • Issue date Aug 17, 2021
    • Tokyo Electron Limited
    • Sho Kumakura
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents